TDA8025HN/C1,551 NXP Semiconductors, TDA8025HN/C1,551 Datasheet - Page 19
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TDA8025HN/C1,551
Manufacturer Part Number
TDA8025HN/C1,551
Description
IC SMART CARD INTERFACE 32-HVQFN
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8025HNC1518.pdf
(38 pages)
Specifications of TDA8025HN/C1,551
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Controller Type
Smart Card Interface
Interface
Analog
Voltage - Supply
1.2V, 1.8V, 3V
Current - Supply
65mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935286389551
NXP Semiconductors
TDA8025_1
Product data sheet
8.10 Fault detection
8.9 V
Table 5.
The V
The V
This detection is filtered, enabling spurious current pulses up to 200 mA with a duration of
up to 200 ns to be drawn by the card without causing deactivation. However, the average
current value must be below maximum.
To enhance V
and one 220 nF capacitor should be tied to pin CGND near the C1 contact. Both
capacitors should have an ESR < 100 m .
The following conditions are monitored by the fault detection circuit:
VCC_SEL1
0
0
1
1
Fig 13. Deactivation sequence with an external clock connected to pin XTAL1
•
•
•
•
•
•
CC
CMDVCCN
RST
CLK
I/O
V
XTAL1
OSCINT
65 mA at 3 V
65 mA at 1.8 V
30 mA at 1.2 V
Short-circuit or high current on pin V
Card removal during transaction
V
CC
regulator
DD(INTREGD)
CC
CC
buffer is able to continuously deliver up to:
buffer has an internal overload protection with a threshold value of 135 mA.
Selection of V
CC
stability, one 470 nF capacitor should be tied to pin CGND near pin 18
falling
t10
t11
Rev. 01 — 6 April 2009
CC
high frequency
using pins VCC_SEL1 and VCC_SEL2
VCC_SEL2
0
1
0
1
t12
t
deact
CC
t13
t14
V
3 V
1.8 V
1.2 V
1.2 V
CC
low frequency
TDA8025
© NXP B.V. 2009. All rights reserved.
IC card interface
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