TDA8025HN/C1,551 NXP Semiconductors, TDA8025HN/C1,551 Datasheet - Page 36
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TDA8025HN/C1,551
Manufacturer Part Number
TDA8025HN/C1,551
Description
IC SMART CARD INTERFACE 32-HVQFN
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8025HNC1518.pdf
(38 pages)
Specifications of TDA8025HN/C1,551
Package / Case
32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
Controller Type
Smart Card Interface
Interface
Analog
Voltage - Supply
1.2V, 1.8V, 3V
Current - Supply
65mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
935286389551
NXP Semiconductors
15. Abbreviations
16. Revision history
Table 14.
TDA8025_1
Product data sheet
Document ID
TDA8025_1
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 13.
Acronym
ATR
ESD
ESR
NMOS
POR
PMOS
Fig 20. Temperature profiles for large and small components
Release date
20090406
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Answer To Request
ElectroStatic Discharge
Equivalent Series Resistance
Negative-channel Metal-Oxide Semiconductor
Power-On Reset
Positive-channel Metal-Oxide Semiconductor
Data sheet status
Product data sheet
Rev. 01 — 6 April 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
temperature
Supersedes
-
peak
TDA8025
© NXP B.V. 2009. All rights reserved.
IC card interface
001aac844
time
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