ISP1761ETGE ST-Ericsson Inc, ISP1761ETGE Datasheet - Page 152
ISP1761ETGE
Manufacturer Part Number
ISP1761ETGE
Description
IC USB CTRL HI-SPEED 128TFBGA
Manufacturer
ST-Ericsson Inc
Datasheet
1.ISP1761BEUM.pdf
(164 pages)
Specifications of ISP1761ETGE
Controller Type
USB Peripheral Controller
Interface
Serial
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
128-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Supply
-
Other names
ISP1761ET
ISP1761ET
ISP1761ET
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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NXP Semiconductors
ISP1761_5
Product data sheet
18.4 Package related soldering information
Table 180. Suitability of through-hole mount IC packages for dipping and wave soldering
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Rev. 05 — 13 March 2008
Soldering method
Dipping
-
suitable
-
Hi-Speed USB OTG controller
Wave
suitable
suitable
not suitable
© NXP B.V. 2008. All rights reserved.
ISP1761
[1]
151 of 163
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