DSPIC30F6014A-30I/PF Microchip Technology Inc., DSPIC30F6014A-30I/PF Datasheet - Page 237

• Manufacturer Part Number: DSPIC30F6014A-30I/PF
• Description: 16 BIT MCU/DSP 80LD 30MIPS 144 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F6014A-30I/PF

• A/d Inputs: 16-Channels, 12-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 4K Bytes
• Input Output: 68
• Interface: CAN/I2C/SPI/UART
• Ios: 68
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 80-pin TQFP
• Programmable Memory: 144K Bytes
• Ram Size: 8K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2005 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F6011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
dsPIC30F6011A/6012A/6013A/6014A
d s P I C 3 0 F 6 0 11 AT - 3 0 I / P F - E S
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
PF = TQFP 14x14
S
W
PT = TQFP 10x10
PT = TQFP 12x12
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70143B-page 235
Speed
20 = 20 MIPS
30 = 30 MIPS