FIN224ACGFX Fairchild Semiconductor, FIN224ACGFX Datasheet
FIN224ACGFX
Manufacturer Part Number
FIN224ACGFX
Description
IC SERIALIZER/DESERIALIZER 42BGA
Manufacturer
Fairchild Semiconductor
Series
SerDes™r
Datasheet
1.FIN224ACMLX.pdf
(19 pages)
Specifications of FIN224ACGFX
Function
Serializer/Deserializer
Data Rate
676Mbps
Input Type
LVCMOS
Output Type
LVCMOS
Number Of Inputs
22
Number Of Outputs
22
Voltage - Supply
1.65 V ~ 3.6 V
Operating Temperature
-30°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
42-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FIN224ACGFXTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FIN224ACGFX
Manufacturer:
FSC
Quantity:
4 000
Company:
Part Number:
FIN224ACGFX
Manufacturer:
Fairchild Semiconductor
Quantity:
10 000
Part Number:
FIN224ACGFX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-6437211, ext.788
Implementation of change:
Expected 1st Device Shipment Date: 2007/05/31
Earliest Year/Work Week of Changed Product: 0724
Change Type Description: Bond Wire Material Composition, Lead Finish Composition, Lid or
Base Material Composition, Mold Compound
Description of Change (From): Mold compound Sumitomo G770; Bond wire HP(99.99); Solder
ball composition SAC405; Solder mask material AUS05
Description of Change (To): Mold compound Nitto GE-100-LFC-S; Bond wire HTS(99.0);
Solder ball composition SAC105; Solder mask material AUS308
Reason for Change : To improve the robustness of the package bill of materials resulting in
increased resistance to intermettalic degradation, use of a Green mold compound, and improved
tolerance to mechanical shock. Overall, the BOM change is being pursued to improve the
reliability of the product.
Qual/REL Plan Numbers : Q20060387
Qualification :
All environmental & mechanical stresses outlined in reliability qualification plan
Q20060387 successfully meet the requirements for release, qualifying Nitto
GE-100-LFC-S green mold compound for use with all BGA42 products assembled at
Amkor Philippines.
Change From
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Morneault, Ron
E-mail: Ron.Morneault@fairchildsemi.com
Phone: 207 761 3412
Date Issued On : 2007/05/09
Date Created : 2007/04/18
PCN# : Q1070902-A
Pg. 1
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FIN224ACGFX Summary of contents
Page 1
... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...
Page 2
... FIN224ACGFX Q20060387ACTMCL1D FIN224ACGFX Q20060387ACTMCL1D FIN224ACGFX Test: 110C (Highly Accelerated Stress Test) Lot Device Q20060387AAHAST2D FIN224ACGFX Q20060387AAHAST2D FIN224ACGFX Q20060387ABHAST2D FIN224ACGFX Q20060387ABHAST2D FIN224ACGFX Q20060387ACHAST2D FIN224ACGFX Q20060387ACHAST2D FIN224ACGFX Test: MSL(2), PKG(Small), PeakTemp(260c), Cycles(3) (Precondition) Lot Device Q20060387AAPCNL2AD FIN224ACGFX Q20060387ABPCNL2AD FIN224ACGFX Q20060387ACPCNL2AD FIN224ACGFX 168-HOURS 1000-HOURS ...
Page 3
... Product Id Description : Affected FSIDs : FIN12ACGFX FIN24ACGFX FIN668CGFX FIN212ACGFX FIN24CGFX FIN670CGFX FIN224ACGFX FIN324CGFX Pg. 3 ...