TLE7239SL Infineon Technologies, TLE7239SL Datasheet - Page 12

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TLE7239SL

Manufacturer Part Number
TLE7239SL
Description
IC DRIVER SPI RELAY CTRL 24SSOP
Manufacturer
Infineon Technologies
Series
-r
Type
High Side/Low Side Driverr
Datasheet

Specifications of TLE7239SL

Input Type
SPI
Number Of Outputs
8
On-state Resistance
900 mOhm, 1.6 Ohm
Current - Output / Channel
175mA, 380mA
Current - Peak Output
500mA, 1A
Voltage - Supply
9 V ~ 16 V
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
24-SSOP (0.154", 3.90mm Width)
Packages
PG-SSOP-24
Channels
8.0
Rds (on) (typ)
0.9 Ohm
Vdd
3.0 - 5.5 V
Vds(cl)
41.0 - 52.0 V
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLE7239SL
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
Pos.
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.3.6
4.3.7
1) Not subject to production test
2) Specified
3) Specified
4) Specified
5) Specified
6) Specified
Data Sheet
Thermal Resistance
T
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with minimal footprint copper area and 70 m thickness.
T
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper area of 300mm
and 70 m thickness.
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper area of 600mm
and 70 m thickness.
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 m Cu, 2 x 35 m Cu).
T
a
a
a
For more information, go to www.jedec.org.
= 85 C. Ch1 to Ch8 are dissipating 1 W power (0.125 W each).
= 85 C, Ch1 to Ch8 are dissipating 1 W power (0.125 W each).
= 85 C, Ch1 to Ch8 are dissipating 1 W power (0.125 W each).
Parameter
Junction to Case, bottom
Junction to Case, top
Junction to Pin (1,2,11 or 12)
Junction to Ambient
(1s0p, min. footprint)
Junction to Ambient
(1s0p+300mm
Junction to Ambient
(1s0p+600mm
Junction to Ambient (2s2p)
R
R
R
R
R
Thermal Resistance
thJSP
thJA
thJA
thJA
thJA
value is according to Jedec JESD51-2,-3 at natural convection on FR4 1s0p board; The product
value is according to Jedec JESD51-2,-3 at natural convection on FR4 1s0p board; The product
value is according to Jedec JESD51-2,-3 at natural convection on FR4 1s0p board; The product
value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The product
value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient temperature).
1)
T
T
2
2
Cu)
Cu)
a
a
= 85 C, Ch1 to Ch8 are dissipating 1 W power (0.125 W each).
= 85 C, Ch1 to Ch8 are dissipating 1 W power (0.125 W each).
Symbol
R
R
R
R
R
R
R
thJC,back
thJC,top
thJPin
thJA,min
thJA,300
thJA,600
thJA,2s2p
12
Min.
SPI Driver for Enhanced Relay Control
Limit Values
Typ.
90
70
65
55
Max.
25
25
17
K/W
K/W
K/W
Unit
K/W
K/W
K/W
K/W
Electrical Characteristics
Rev. 1.1, 2011-04-05
Conditions
2)
3)
4)
5)
6)
2)
2)
TLE7239SL
2
2

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