LPC1786FBD208,551 NXP Semiconductors, LPC1786FBD208,551 Datasheet - Page 101

• Manufacturer Part Number: LPC1786FBD208,551
• Description: Processors - Application Specialized CORTEX-M3 256KB FL 80KB SRAM 4KB EE USB
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1786FBD208,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 165
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 80K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Lead Free Status / Rohs Status: Details
• Other names: 935291855551

NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 37. USB device port configuration
14.2 Crystal oscillator XTAL input and component selection
LPC17xx
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
capacitor to ground C
mode, a minimum of 200 mV(RMS) is needed.
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in
Table 32
and the capacitances C
fundamental mode oscillation (the fundamental frequency is represented by L, C
R
not be larger than 7 pF. Parameters F
manufacturer.
Fig 38. Slave mode operation of the on-chip oscillator
i
S
= 100 pF. To limit the input voltage to the specified range, choose an additional
). Capacitance C
USB_UP_LED
USB_CONNECT
USB_D+
USB_D−
V
BUS
38), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This
and
Table
All information provided in this document is subject to legal disclaimers.
33 Ω
33 Ω
P
33. Since the feedback resistance is integrated on chip, only a crystal
in
g
V
which attenuates the input voltage by a factor C
Figure 39
X1
DD
Rev. 2 — 27 May 2011
and C
V
DD
X2
represents the parallel package capacitance and should
need to be connected externally in case of
OSC
XTAL1
LPC1xxx
C i
100 pF
, C
L
, R
S
002aae835
32-bit ARM Cortex-M3 microcontroller
C g
and C
P
are supplied by the crystal
V
SS
V
BUS
D+
D−
LPC178x/7x
USB-B
connector
002aad943
i
/(C
© NXP B.V. 2011. All rights reserved.
Figure 39
i
+ C
g
). In slave
L
101 of 117
and
and in