TLE8262EXT Infineon Technologies, TLE8262EXT Datasheet - Page 91

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TLE8262EXT

Manufacturer Part Number
TLE8262EXT
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLE8262EXT

Operating Supply Voltage (typ)
9/12/15/18/24/28V
Operating Supply Voltage (min)
5.5V
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
36
Lead Free Status / Rohs Status
Supplier Unconfirmed
17
Figure 44
Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations, the Universal System Basis Chip is available as a green product. Green products are
RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-
020).
For information about packages and types of packing, refer to the
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
Package Outline
PG-DSO-36-38 (Leadframe A6901-003);)
Index Marking
Ejector Mark
Polish Finish
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Exclunding the mold flash allowance of 0.3mm MAX per side
Exposed Diepad Dimensions
Package
PG-DSO-36-24, -41, -42
PG-DSO-36-38
PG-DSO-36-38
PG-DSO-36-24
0.33
±0.08
17 x 0.65 = 11.05
36
2)
1
12.8
0.65
-0.2
0.17
1)
B
A
18
19
M
C
Leadframe
A6901-C001
A6901-C003
A6901-C007
A6901-C008 6.0 5.4
A-B
Ejector Mark
Cavity ID
4)
SEATING PLANE
C
D
0.1
36x
C
5.2
X
7
7
36x
91
5.1
5.1
4.6
Y
19
18
Bottom View
7.6
10.3
0.7
-0.2
0.35 x 45˚
X
±0.2
±0.3
1)
PG-DSO-36-24, -38, -41, -42-PO V08
36
1
D
Exposed Diepad
Index Marking
Rev. 1.0, 2009-03-31
Dimensions in mm
Package Outline
TLE8262E

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