SC16IS850LIBS,128 NXP Semiconductors, SC16IS850LIBS,128 Datasheet - Page 56

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SC16IS850LIBS,128

Manufacturer Part Number
SC16IS850LIBS,128
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SC16IS850LIBS,128

Lead Free Status / Rohs Status
Compliant
NXP Semiconductors
16. Abbreviations
SC16IS850L
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 43.
Acronym
CMOS
CPU
FIFO
I
IrDA
LSB
MSB
SIR
SPI
UART
2
Fig 34. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Complementary Metal-Oxide Semiconductor
Central Processing Unit
First In, First Out
Inter-Integrated Circuit-bus
Infrared Data Association
Least Significant Bit
Most Significant Bit
Serial InfraRed
Serial Peripheral Interface
Universal Asynchronous Receiver/Transmitter
Rev. 1 — 22 July 2011
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Single UART with I
temperature
SC16IS850L
peak
2
C-bus/SPI interface
© NXP B.V. 2011. All rights reserved.
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