M29W128GL70N6E Micron Technology Inc, M29W128GL70N6E Datasheet - Page 15

• Manufacturer Part Number: M29W128GL70N6E
• Manufacturer: Micron Technology Inc

Specifications of M29W128GL70N6E

• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 24/23Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 16M/8M
• Supply Current: 10mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Compliant

2.9
2.10
2.11
2.12
2.13
Reset (RP)
The reset pin can be used to apply a hardware reset to the memory.
A hardware reset is achieved by holding reset Low, V
High, V
t
AC
Ready/busy output (RB)
The ready/busy pin is an open-drain output that can be used to identify when the device is
performing a program or erase operation. During program or erase operations ready/busy is
Low, V
mode, auto select mode and erase suspend mode.
After a hardware reset, bus read and bus write operations cannot begin until ready/busy
becomes high-impedance. See
Figure
The use of an open-drain output allows the ready/busy pins from several memories to be
connected to a single pull-up resistor. A Low will then indicate that one, or more, of the
memories is busy.
Byte/word organization select (BYTE)
It is used to switch between the x8 and x16 bus modes of the memory. When byte/word
organization select is Low, V
is in x16 mode.
V
V
The command interface is disabled when the V
voltage, V
during power-up, power-down and power surges. If the program/erase controller is
programming or erasing during this time then the operation aborts and the memory contents
being altered will be invalid.
A 0.1 μF capacitor should be connected between the V
ground pin to decouple the current surges from the power supply. The PCB track widths
must be sufficient to carry the currents required during program and erase operations (see
I
V
V
independently from V
RHEL
CC1
CC
CCQ
CC
CCQ
characteristics,
, I
provides the power supply for all operations (read, program and erase).
, whichever occurs last. See
CC2
provides the power supply to the I/O pins and enables all outputs to be powered
supply voltage
OL
23.
IH
input/output supply voltage
, the memory will be ready for bus read and bus write operations after t
(see
, I
LKO
CC3
. This prevents bus write operations from accidentally damaging the data
Table 20: Status register
in
Table 25: DC
Figure 22
CC
.
IL
and
, the memory is in x8 mode, when it is High, V
Table 29: Reset AC
characteristics).
Figure 23
Section 2.10: Ready/busy output
bits). Ready/busy is high-impedance during read
for more details.
CC
supply voltage is less than the lockout
characteristics,
IL
, for at least t
CC
supply voltage pin and the V
(RB),
Figure 22
PLPX
. After reset goes
Table 29: Reset
IH
, the memory
and
PHEL
or
15/94
SS