TE28F800B3TA110 Intel, TE28F800B3TA110 Datasheet - Page 26
![no-image](/images/manufacturer_photos/0/3/336/intel_sml.jpg)
TE28F800B3TA110
Manufacturer Part Number
TE28F800B3TA110
Description
Manufacturer
Intel
Datasheet
1.TE28F800B3TA110.pdf
(70 pages)
Specifications of TE28F800B3TA110
Cell Type
NOR
Density
8Mb
Access Time (max)
110ns
Interface Type
Parallel
Boot Type
Top
Address Bus
19b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
16b
Number Of Words
512K
Supply Current
18mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TE28F800B3TA110
Manufacturer:
INTEL
Quantity:
1 871
Part Number:
TE28F800B3TA110
Manufacturer:
INTEL
Quantity:
20 000
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
4.3
26
Dimensions Table
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are subject to change.
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Figure 4. Easy BGA Package Drawing
Ball A1
Corner
Easy BGA Package
E
A2
B
C
D
E
F
G
H
A
1
Top View - Ball side down
A1
2
3
Side View
4
D
5
6
Symbol
A
A
7
[e]
S
S
A
D
N
b
E
Y
1
2
1
2
8
Millimeters
12.900
0.250
0.330
1.400
2.900
9.900
Min
A
A
B
C
D
G
H
E
F
10.000
13.000
0.780
0.430
1.000
1.500
3.000
Nom
8
64
Seating
Plane
Bottom View - Ball Side Up
7
10.100
13.100
6
1.200
0.530
0.100
1.600
3.100
Max
5
Notes
Note: Drawing not to scale
4
1
1
1
1
3
Inches
0.0098
0.0130
0.3898
0.5079
0.0551
0.1142
Min
2
1
Y
S1
0.0307
0.0169
0.3937
0.5118
0.0394
0.0591
0.1181
Nom
64
b
e
S2
Ball A1
Corner
Datasheet
0.0472
0.0209
0.3976
0.5157
0.0039
0.0630
0.1220
Max