MT48LC8M16A2P-6A Micron Technology Inc, MT48LC8M16A2P-6A Datasheet - Page 73
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MT48LC8M16A2P-6A
Manufacturer Part Number
MT48LC8M16A2P-6A
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC8M16A2P-6A.pdf
(74 pages)
Specifications of MT48LC8M16A2P-6A
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
5.4ns
Maximum Clock Rate
167MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
165mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48LC8M16A2P-6A
Manufacturer:
MT
Quantity:
162
Part Number:
MT48LC8M16A2P-6A
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT48LC8M16A2P-6A AIT:L
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT48LC8M16A2P-6A IT:L
Manufacturer:
MICRON
Quantity:
250
Company:
Part Number:
MT48LC8M16A2P-6A:L
Manufacturer:
MICRON
Quantity:
7 660
Part Number:
MT48LC8M16A2P-6A:L
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT48LC8M16A2P-6AG
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT48LC8M16A2P-6AIT
Manufacturer:
NXP
Quantity:
23 000
Part Number:
MT48LC8M16A2P-6AIT:L
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 57:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
DIMENSIONS APPLY
TO SOLDER BALLS
POST REFLOW. PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33 NSMD
BALL PAD.
16.00 ±0.10
60-Ball FBGA “FB/BB” Package (x8 device), 8mm x 16mm
60X Ø 0.45
8.00 ±0.05
Notes:
5.60
BALL
A8
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
0.155 ±0.013
0.850 ±0.05
2.40 ±0.05
8.00 ±0.10
2.80
0.80
TYP
CTR
5.60
4.00 ±0.05
C L
A
BALL A1
0.80
TYP
BALL #1 ID
11.20
73
SEATING PLANE
0.10 A
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
SOLDER BALL MATERIAL:
SUBSTRATE:
ENCAPSULATION MATERIAL:
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn. 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVOLAC
128Mb: x4, x8, x16 SDRAM
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
BALL #1 ID