MT48LC8M16A2P-6A Micron Technology Inc, MT48LC8M16A2P-6A Datasheet - Page 74
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MT48LC8M16A2P-6A
Manufacturer Part Number
MT48LC8M16A2P-6A
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC8M16A2P-6A.pdf
(74 pages)
Specifications of MT48LC8M16A2P-6A
Organization
8Mx16
Density
128Mb
Address Bus
14b
Access Time (max)
5.4ns
Maximum Clock Rate
167MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
165mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT48LC8M16A2P-6A
Manufacturer:
MT
Quantity:
162
Part Number:
MT48LC8M16A2P-6A
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT48LC8M16A2P-6A AIT:L
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT48LC8M16A2P-6A IT:L
Manufacturer:
MICRON
Quantity:
250
Company:
Part Number:
MT48LC8M16A2P-6A:L
Manufacturer:
MICRON
Quantity:
7 660
Part Number:
MT48LC8M16A2P-6A:L
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT48LC8M16A2P-6AG
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT48LC8M16A2P-6AIT
Manufacturer:
NXP
Quantity:
23 000
Part Number:
MT48LC8M16A2P-6AIT:L
Manufacturer:
MICRON/美光
Quantity:
20 000
Figure 58:
PDF: 09005aef8091e66d/Source: 09005aef8091e625
128MSDRAM_2.fm - Rev. N 1/09 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
set forth herein. Although considered final, these specifications are subject to change, as further product development and
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
6.40
54-Ball VFBGA “F4/B4” Package (x16 device), 8mm x 8mm
0.10 C
BALL A9
3.20
Notes:
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
0.65 ±0.05
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
1. All dimensions in millimeters.
2. Recommended pad size for PCB is 0.40mm SMD.
3. Topside part marking decoder can be found at http://www.micron.com/decoder.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
data characterization sometimes occur.
their respective owners.
0.80 TYP
C L
BALL A1
BALL A1 ID
74
4.00 ±0.05
®
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
128Mb: x4, x8, x16 SDRAM
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.40
Package Dimensions
©1999 Micron Technology, Inc. All rights reserved.
BALL A1 ID