BGS12AE6327 Infineon Technologies, BGS12AE6327 Datasheet
BGS12AE6327
Specifications of BGS12AE6327
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BGS12AE6327 Summary of contents
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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BGS12A Revision History: 2007-09-14, V1.1 Previous Version: 2006-10-19, V1.0 Page Subjects (major changes since last revision) All Document layout change Preliminary Data Sheet 3 BGS12A SPDT RF Switch V1.1, 2007-09-14 ...
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BGS12A Features • Low insertion loss • High port-to-port-isolation • Low harmonic generation • On-chip control logic • Lead free solder bumps • High ESD robustness • No external components required • General purpose switch for applications ...
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Table 1 Maximum Ratings Parameter Storage temperature range DC Voltage at all pins to GND RF power max. at all RF ports ESD Capability Human Body-Model IEC61340-3-1 Machine-Model IEC61340-3-2 Table 2 Operation Ranges Parameter Ambient temperature RF Frequency Control voltage ...
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Table 3 Pin description Pin Name 1 RF1 2 GND 3 RF2 4 CTRL 5 RFIN 6 Vdd Figure 2 Pinning Table 4 Truth Table Ctrl Preliminary Data Sheet Description RF Port 1 Out Ground RF Port ...
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Electrical Specifications • Termination port impedance: T • Temperature range °C V • Supply Voltage • dBm in • Across operating range of control voltages: Table 5 Electrical Characteristics Parameter 1) ...
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Package Outlines Figure 3 Package outline bump height: 90 ± 14µm chip height: 250µm BGS 12A _Solder _Bumps.vsd Figure 4 Solder bumps Dimensions in mm You can find all of our packages, sorts of packing and others in our Infineon ...