MT29F4G08ABBDAH4:D Micron Technology Inc, MT29F4G08ABBDAH4:D Datasheet - Page 9

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MT29F4G08ABBDAH4:D

Manufacturer Part Number
MT29F4G08ABBDAH4:D
Description
MICMT29F4G08ABBDAH4:D 4G SLC NAND FLASH
Manufacturer
Micron Technology Inc

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Signal Assignments
Figure 2: 48-Pin TSOP – Type 1 (Top View)
PDF: 09005aef83b25735
m60a_4gb_nand.pdf – Rev. J 9/11 EN
R/B#2
CE2#
R/B#
WE#
WP#
x16
ALE
RE#
CE#
V
CLE
V
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
CC
SS
3
3
R/B2#
CE2#
WE#
WP#
R/B#
RE#
CE#
ALE
V
CLE
V
Notes:
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
x8
CC
SS
3
3
2. See Asynchronous Interface Bus Operation for detailed asynchronous interface signal
1. These pins might not be bonded in the package; however, Micron recommends that the
2. For the 3V device, pin 38 is DNU. For the 1.8V device, pin 38 is LOCK.
3. R/B2# and CE2# are available on 16Gb devices only. They are NC for other configura-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
descriptions.
customer connect these pins to the designated external sources for ONFI compatibility.
tions.
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Signal Assignments
© 2009 Micron Technology, Inc. All rights reserved.
x8
V
DNU
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
V
DNU
V
V
NC
V
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
DNU
V
SS
CC
CC
SS
CC
SS
1
1
1
1
2
x16
V
I/O15
I/O14
I/O13
I/O7
I/O6
I/O5
I/O4
I/O12
V
DNU
V
V
NC
V
I/O11
I/O3
I/O2
I/O1
I/O0
I/O10
I/O9
I/O8
V
SS
CC
CC
SS
CC
SS
2

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