DS3170N+ Maxim Integrated Products, DS3170N+ Datasheet - Page 10
DS3170N+
Manufacturer Part Number
DS3170N+
Description
IC TXRX DS3/E3 100-CSBGA
Manufacturer
Maxim Integrated Products
Datasheet
1.DS3170.pdf
(230 pages)
Specifications of DS3170N+
Function
Single-Chip Transceiver
Interface
DS3, E3
Number Of Circuits
1
Voltage - Supply
3.135 V ~ 3.465 V
Current - Supply
120mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-LBGA
Includes
DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
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1 DETAILED DESCRIPTION
The DS3170 is a software-configured, DS3/E3, single-chip transceiver (SCT). The line interface unit (LIU) has
independent receive and transmit paths. The receiver LIU block performs clock and data recovery from a B3ZS- or
HDB3-coded AMI signal and monitors for loss of the incoming signal, and can be bypassed for direct clock and
data input. The receiver LIU block optionally performs B3ZS/HDB3 decoding. The transmitter LIU drives standard
pulse-shape waveforms onto 75Ω coaxial cable and can be bypassed for direct clock and data output. The jitter
attenuator can be put in the transmit or receive data path when the LIU is enabled. Built-in DS3/E3 framers transmit
and receive data in properly formatted C-bit DS3, M23 DS3, G.751 E3 or G.832 E3 data streams. Functions not
used are powered down to reduce system power requirements. The DS3170 conforms to the telecommunications
standards listed in
2 BLOCK DIAGRAMS
Figure 2-1
functional block diagram of the one channel DS3/E3 SCT.
Figure 2-1. LIU External Connections for the DS3/E3 Port of DS3170
shows the external components required at the LIU interface for proper operation.
Transmit
Receive
Table
5-1.
1:2ct
1:2ct
330 Ω
(1%)
330 Ω
(1%)
DS3/E3 LIU Interface
10 of 230
TXP
TXN
RXP
RXN
VDD
VDD
VDD
VSS
VSS
VSS
DS3170 DS3/E3 Single-Chip Transceiver
0.01uF
0.01uF
0.01uF
0.1uF
0.1uF
0.1uF
1uF
1uF
1uF
Ground
Plane
Figure 2-2
3.3V
Power
Plane
shows the
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