DS3170N+ Maxim Integrated Products, DS3170N+ Datasheet - Page 92
![IC TXRX DS3/E3 100-CSBGA](/photos/6/94/69414/100-csbga_21-0153b_sml.jpg)
DS3170N+
Manufacturer Part Number
DS3170N+
Description
IC TXRX DS3/E3 100-CSBGA
Manufacturer
Maxim Integrated Products
Datasheet
1.DS3170.pdf
(230 pages)
Specifications of DS3170N+
Function
Single-Chip Transceiver
Interface
DS3, E3
Number Of Circuits
1
Voltage - Supply
3.135 V ~ 3.465 V
Current - Supply
120mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-LBGA
Includes
DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
- Current page: 92 of 230
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Figure 10-17. G.832 E3 Frame Format
Figure 10-18. MA Byte Format
Table 10-29
Table 10-29. G.832 E3 Frame Overhead Bit Definitions
FA1, FA2
EM
TR
MA
NR
GC
FA1
EM
MA
GC
TR
NR
BYTE
MSB
RDI
1
FA2
RDI - Remote Defect Indicator
REI - Remote Error Indicator
SL - Signal Label
MI - Multi-frame Indicator
TM - Timing Marker
shows the function of each overhead bit in the DS3 Frame.
REI
Frame Alignment bytes
Error Monitoring byte
Trail Trace byte
Maintenance and Adaption
byte
Network Operator byte
General Purpose
Communication Channel byte
SL
SL
DEFINITION
SL
MI
530 Byte Payload
MI
59 Columns
92 of 230
LSB
TM
8
DS3170 DS3/E3 Single-Chip Transceiver
9 Rows
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