DS3170N+ Maxim Integrated Products, DS3170N+ Datasheet - Page 16

• Manufacturer Part Number: DS3170N+
• Description: IC TXRX DS3/E3 100-CSBGA
• Manufacturer: Maxim Integrated Products

Specifications of DS3170N+

• Function: Single-Chip Transceiver
• Interface: DS3, E3
• Number Of Circuits: 1
• Voltage - Supply: 3.135 V ~ 3.465 V
• Current - Supply: 120mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-LBGA
• Includes: DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -

5 STANDARDS COMPLIANCE
Table 5-1. Standards Compliance
ANSI
ATM Forum
ETSI
IETF
ISO
ITU-T
TELCORDIA
IEEE
SPECIFICATION
ETS EN 300 689
af-phy-0034.000
af-phy-0054.000
IEEE Std 1149-
ISO 3309:1993
GR-499-CORE
GR-820-CORE
ETS 300 686
ETS 300 689
T1.102-1993
T1.107-1995
T1.231-1997
T1.404-1994
T1.646-1995
RFC 2496
TBR 24
G.703
G.704
G.751
G.775
G.823
G.824
G.832
O.151
Q.921
I.432
1990
Digital Hierarchy – Electrical Interfaces
Digital Hierarchy – Formats Specification
Digital Hierarchy – Layer 1 In-Service Digital Transmission Performance Monitoring
Network-to-Customer Installation – DS3 Metallic Interface Specification
Broadband ISDN – Physical Layer Specification for User-Network Interfaces Including
DS1/ATM
E3 Public UNI, August, 1995
DS3 Physical Layer Interface Specification, January, 1996
Business TeleCommunications; 34Mbps and 140Mbits/s digital leased lines (D34U, D34S,
D140U and D140S); Network interface presentation, 1996
Business TeleCommunications; 34Mbit/s digital unstructured and structured lease lines;
attachment requirements for terminal equipment interface, 1997
Access and Terminals (AT); 34Mbps Digital Leased Lines (D34U and D34S); Terminal
equipment interface, July 2001
Business TeleCommunications (BTC); 34 Mbps digital leased lines (D34U and D34S),
Terminal equipment interface, V 1.2.1, 2001-07
Definition of Managed Objects for the DS3/E3 Interface Type, January, 1999
Information Technology – Telecommunications & information exchange between systems –
High Level Data Link Control (HDLC) procedures – Frame structure, Fifth Edition, 1993
Physical/Electrical Characteristics of Hierarchical Digital Interfaces, 1991
Synchronous Frame Structures Used at 1544, 6312, 2048, 8488 and 44 736 kbit/s
Hierarchical Levels, July, 1995
Digital Multiplex Equipment Operating at the Third Order Bit Rate of 34,368 kbit/s and the
Fourth Order bit Rate of 139,264 kbit/s and Using Positive Justification, 1993
Loss Of Signal (LOS) and Alarm Indication Signal (AIS) Defect Detection and Clearance
Criteria, November, 1994
The Control of Jitter and Wander Within Digital Networks Which are Based on the 2048
kbit/s Hierarchy, 1993
The Control of Jitter and Wander within Digital Networks that are Based on the 1544kbps
Hierarchy, 1993
Transport of SDH Elements on PDH Networks – Frame and Multiplexing Structures,
November, 1995
B-ISDN User-Network Interface – Physical Layer Specification, March, 1993
Error Performance Measuring Equipment Operating at the Primary Rate and Above,
October, 1992
ISDN User-Network Interface – Data Link Layer Specification, March 1993
Transport Systems Generic Requirements (TSGR): Common Requirements, Issue 2,
December 1998
Generic Digital Transmission Surveillance, Issue 1, November 1994
IEEE Standard Test Access Port and Boundary-Scan Architecture, (Includes IEEE Std
1149-1993) October 21, 1993
16 of 230
SPECIFICATION TITLE
DS3170 DS3/E3 Single-Chip Transceiver