ADP1875 Analog Devices, ADP1875 Datasheet - Page 6

• Manufacturer Part Number: ADP1875
• Description: Synchronous Buck Controller with Constant On-Time, Valley Current Mode, and Power Saving Mode
• Manufacturer: Analog Devices

ADP1874/ADP1875
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VREG, VREG_IN, TRACK to PGND, GND
VIN, EN, PGOOD to PGND
FB, COMP, RES, SS to GND
DRVL to PGND
SW to PGND
BST to SW
BST to PGND
DRVH to SW
PGND to GND
PGOOD Input Current
θ
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
JA
4-Layer Board
(10 sec)
(16-Lead QSOP)
Rating
−0.3 V to +6 V
−0.3 V to +28 V
−0.3 V to (VREG + 0.3 V)
−0.3 V to (VREG + 0.3 V)
−2.0 V to +28 V
−0.6 V to (VREG + 0.3 V)
−0.3 V to +28 V
−0.3 V to VREG
±0.3 V
35 mA
104°C/W
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
300°C
Rev. 0 | Page 6 of 44
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θ
BOUNDARY CONDITION
In determining the values given in Table 2 and Table 3, natural
convection is used to transfer heat to a 4-layer evaluation board.
ESD CAUTION
JA
JA
4-Layer Board
(16-Lead QSOP)
is specified for the worst-case conditions, that is, a device
θ
104°
JA
Unit
°C/W