PMEG2010EPA NXP Semiconductors, PMEG2010EPA Datasheet - Page 7

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection

PMEG2010EPA

Manufacturer Part Number
PMEG2010EPA
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
PMEG2010EPA_1
Product data sheet
Fig 7.
Fig 9.
P
I
F(AV)
F(AV)
(W)
(A)
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
0.5
0.4
0.3
0.2
0.1
0.0
1.5
1.0
0.5
0.0
0.0
T
Average forward power dissipation as a
function of average forward current; typical
values
0
FR4 PCB, standard footprint
T
Average forward current as a function of
ambient temperature; typical values
j
j
= 150 °C
= 150 °C
25
(1)
(2)
(3)
(4)
50
(1)
0.5
75
(2)
100
1.0
(3)
125
I
F(AV)
T
amb
006aab631
006aab633
150
(A)
(°C)
(4)
Rev. 01 — 15 December 2009
175
1.5
Fig 8.
Fig 10. Average forward current as a function of
P
I
F(AV)
R(AV)
(W)
(A)
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
1.5
1.0
0.5
1.5
1.0
0.5
0.0
0
0
0
T
Average reverse power dissipation as a
function of reverse voltage; typical values
FR4 PCB, mounting pad for cathode 1 cm
T
ambient temperature; typical values
1 A low V
j
j
= 125 °C
= 150 °C
25
(1)
(2)
(3)
(4)
50
F
5
MEGA Schottky barrier rectifier
PMEG2010EPA
75
(1)
(2)
(3)
100
10
125
T
© NXP B.V. 2009. All rights reserved.
V
amb
R
006aab632
006aab634
150
(V)
(4)
(°C)
2
175
15
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