FAN5069 Fairchild Semiconductor, FAN5069 Datasheet - Page 4

• Manufacturer Part Number: FAN5069
• Description: The FAN5069 combines a high efficiency Pulse-Width-Modulated PWM controller and a LDO (Low DropOut) linear regulator controller
• Manufacturer: Fairchild Semiconductor

FAN5069 Rev. 1.1.5
© 2005 Fairchild Semiconductor Corporation
Absolute Maximum Ratings
The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are
not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the condi-
tions for actual device operation.
Notes:
1.
2.
Thermal Information
Notes:
3.
Recommended Operating Conditions
V
BOOT to PGND
SW to PGND
HDRV (V
LDRV
All Other Pins
Maximum Shunt Current for V
Electrostatic Discharge Protection (ESD)
Level
Symbol
CC
Symbol
T
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at these or any conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are referenced to AGND.
Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Junction-to-ambient thermal resistance, θ
number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat
sink characteristics.
θ
θ
V
P
STG
T
to PGND
T
T
JC
JA
(2)
CC
L
D
A
J
BOOT
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Seconds
Infrared, 15 Seconds
Power Dissipation, T
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
Supply Voltage
Ambient Temperature
Junction Temperature
- – V
SW
)
Parameter
CC
(1)
Parameter
A
Parameter
= 25°C
JA
, is a strong function of PCB material, board thickness, thickness and
Transient (t < 50nS, F < 500kHz)
Conditions
V
Commercial
CC
Industrial
(3)
to GND
4
Continuous
CDM
HBM
Min.
-65
Min.
-10
-40
4.5
Typ.
100
37
Min.
Typ.
-0.5
-3.0
-0.5
-0.3
3.5
1.8
5.0
Max.
150
300
215
220
715
V
CC
Max.
Max.
33.0
33.0
33.0
150
125
6.0
6.0
6.0
5.5
85
85
+ 0.3
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°C/W
°C/W
Unit
mW
°C
°C
°C
°C
Unit
Unit
mA
°C
°C
°C
kV
V
V
V
V
V
V
V
V