FAN3227T Fairchild Semiconductor, FAN3227T Datasheet - Page 2
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FAN3227T
Manufacturer Part Number
FAN3227T
Description
The FAN3226-29 family of dual 2A gate drivers is designed to drive N-channel enhancement-mode MOSFETs in low-side switching applications by providing high peak current pulses during the short switching intervals
Manufacturer
Fairchild Semiconductor
Datasheet
1.FAN3227C.pdf
(25 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FAN3227T
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Part Number:
FAN3227TMX
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
© 2007 Fairchild Semiconductor Corporation
FAN3226 / FAN3227 / FAN3228 / FAN3229 • Rev. 1.0.8
Ordering Information
Part Number
FAN3226CMPX
FAN3226CMX
FAN3226TMPX
FAN3226TMX
FAN3227CMPX
FAN3227CMX
FAN3227TMPX
FAN3227TMX
FAN3228CMPX
FAN3228CMX
FAN3228TMPX
FAN3228TMX
FAN3229CMPX
FAN3229CMX
FAN3229TMPX
FAN3229TMX
Package Outlines
Thermal Characteristics
8-Lead 3x3mm Molded Leadless Package (MLP)
8-Pin Small Outline Integrated Circuit (SOIC)
Notes:
1.
2.
3.
4.
5.
6.
Estimates derived from thermal simulation; actual values depend on the application.
Theta_JL (
thermal pad) that are typically soldered to a PCB.
Theta_JT (
held at a uniform temperature by a top-side heatsink.
Theta_JA (Θ
The value given is for natural convection with no heatsink using a 2S2P board, as specified in JEDEC standards JESD51-2,
JESD51-5, and JESD51-7, as appropriate.
Psi_JB (
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
Psi_JT (
the center of the top of the package for the thermal environment defined in Note 4.
Figure 2. 3x3mm MLP-8 (Top View)
JB
JT
): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
JL
JT
JA
Dual Inverting Channels +
Dual Enable
Dual Non-Inverting Channels
+ Dual Enable
Dual Channels of Two-Input /
One-Output Drivers, Pin
Configuration 1
Dual Channels of Two-Input /
One-Output Drivers, Pin
Configuration 2
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
Package
Logic
(1)
Threshold
Input
CMOS
CMOS
CMOS
CMOS
TTL
TTL
TTL
TTL
2
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
3x3mm MLP-8
SOIC-8
1.6
40
JL
(2)
Package
Figure 3. SOIC-8 (Top View)
68
31
JT
(3)
JA
43
89
Packing Method
(4)
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
3.5
43
JB
(5)
0.8
3.0
JT
www.fairchildsemi.com
(6)
Quantity
per Reel
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
3,000
2,500
Units
°C/W
°C/W