FPF2300 Fairchild Semiconductor, FPF2300 Datasheet - Page 4

• Manufacturer Part Number: FPF2300
• Manufacturer: Fairchild Semiconductor

© 2009 Fairchild Semiconductor Corporation
FPF2300/02/03 • Rev. 1.1.3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only
Notes:
1.
2.
3.
4.
Recommended Operating Range
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Symbol
T
Two-layer PCB of 2s0p from JEDEC STD 51-3.
Four-layer PBD of 2s0p from JEDEC STD 51-7.
Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3.
Soldered thermal pad on a four-layer with two vias connected with GND plane base on JEDEC STD 51-5, 7.
ESD
Θ
P
STG
IN
T
JA
A
D
Parameter
IN, OUTA, OUTB, ONA, ONB, FLAGB(A), FLAGB(B) to GND
Power Dissipation
Storage Temperature
Thermal Resistance, Junction-to-Ambient
Electrostatic Discharge Protection
Parameter
Supply Input
Ambient Operating Temperature
.
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
4
SO8
MLP
SO8
MLP
Min.
Min.
4000
2000
-0.3
-65
1.8
-40
Max.
Max.
158
216
0.8
1.4
0.6
2.2
+150
92
57
+85
6.0
5.5
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(2)
(4)
(1)
(2)
(3)
(4)
(1)
(3)
Unit
°C/W
Unit
°C
°C
W
V
V
V