FDMC2512SDC Fairchild Semiconductor, FDMC2512SDC Datasheet

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FDMC2512SDC

Manufacturer Part Number
FDMC2512SDC
Description
Manufacturer
Fairchild Semiconductor
Datasheet

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Part Number
Manufacturer
Quantity
Price
Part Number:
FDMC2512SDC
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
FDMC2512SDC
Quantity:
3 000
©2010 Fairchild Semiconductor Corporation
FDMC2512SDC Rev.C2
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
FDMC2512SDC
N-Channel Dual Cool
25 V, 40 A, 2.0 mΩ
Features
V
V
I
E
dv/dt
P
T
R
R
R
R
R
R
R
D
DS
GS
AS
D
J
θJC
θJC
θJA
θJA
θJA
θJA
θJA
Dual Cool
Max r
Max r
High performance technology for extremely low r
SyncFET Schottky Body Diode
RoHS Compliant
, T
Symbol
Device Marking
STG
DS(on)
DS(on)
2512S
TM
= 2.0 mΩ at V
= 2.95 mΩ at V
Top
Top Side Cooling PQFN package
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous (Package limited)
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
GS
FDMC2512SDC
GS
= 10 V, I
Power 33
= 4.5 V, I
-Continuous
-Continuous (Silicon limited)
-Pulsed
Device
TM
D
Pin 1
D
= 27 A
= 22 A
T
PowerTrench
A
S
= 25°C unless otherwise noted
S
Parameter
Dual Cool
DS(on)
S
G
Bottom
Package
TM
1
Power 33
D
T
T
T
T
T
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor’s
Advancements in both silicon and Dual Cool
technologies have been combined to offer the lowest r
while maintaining excellent switching performance by extremely
low Junction-to-Ambient thermal resistance. This device has the
added benefit of an efficient monolithic Schottky body diode.
Applications
A
C
C
A
C
®
D
= 25 °C
= 25 °C
= 25 °C
= 25 °C
= 25 °C
Synchronous Rectifier for DC/DC Converters
Telecom Secondary Side Rectification
High End Server/Workstation Vcore Low Side
D
SyncFET
D
Reel Size
(Bottom Drain)
(Top Source)
13’’
(Note 1a)
(Note 1a)
(Note 1a)
(Note 1b)
(Note 1k)
(Note 1i)
(Note 1j)
(Note 4)
(Note 3)
(Note 5)
advanced
D
D
D
D
TM
5
6
7
8
Tape Width
12 mm
-55 to +150
PowerTrench
Ratings
±20
148
200
144
105
4.5
1.9
1.8
3.0
25
40
32
66
42
17
26
12
www.fairchildsemi.com
®
3000 units
TM
July 2010
Quantity
4
3
2
1
process.
package
G
S
S
S
Units
°C/W
V/ns
mJ
DS(on)
°C
W
V
V
A

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FDMC2512SDC Summary of contents

Page 1

... R Thermal Resistance, Junction to Ambient θJA Package Marking and Ordering Information Device Marking Device 2512S FDMC2512SDC ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev.C2 TM ® PowerTrench SyncFET General Description This N-Channel MOSFET is produced using Fairchild Semiconductor’ Advancements in both silicon and Dual Cool ...

Page 2

... Gate to Drain “Miller” Charge gd Drain-Source Diode Characteristics V Source to Drain Diode Forward Voltage SD t Reverse Recovery Time rr Q Reverse Recovery Charge rr ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev. 25°C unless otherwise noted J Test Conditions mA mA, referenced to 25 °C D ...

Page 3

... As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied. ≤ di/dt ≤ 200 A/μs, V ≤ Starting DSS ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev. °C/W when mounted pad copper 2 pad copper 2 pad copper ...

Page 4

... DUTY CYCLE = 0.5% MAX 125 1.0 1.5 2.0 2 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev. °C unless otherwise noted μ 2 100 125 150 200 ...

Page 5

... MAX RATED J 0 105 C/W θ 0.01 0.01 0 DRAIN to SOURCE VOLTAGE (V) DS Figure 11. Forward Bias Safe Operating Area ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev. °C unless otherwise noted 160 120 100 ...

Page 6

... Typical Characteristics 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 0.001 0.0005 - Figure 13. Junction-to-Ambient Transient Thermal Response Curve ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev. °C unless otherwise noted J SINGLE PULSE 105 C/W θ RECTANGULAR PULSE DURATION (sec ...

Page 7

... 100 TIME (ns) Figure 14. FDMC2512SDC SyncFET body diode reverse recovery characteristic ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev.C2 (continued) Schottky barrier diodes exhibit significant leakage at high tem- perature and high reverse voltage. This will increase the power in the device. -2 ...

Page 8

... Dimensional Outline and Pad Layout ©2010 Fairchild Semiconductor Corporation FDMC2512SDC Rev.C2 8 www.fairchildsemi.com ...

Page 9

... Definition of Terms Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production FDMC2512SDC Rev.C2 F-PFS™ Power-SPM™ ® FRFET PowerTrench SM Global Power Resource PowerXS™ Green FPS™ Programmable Active Droop™ ...

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