FDMA7672 Fairchild Semiconductor, FDMA7672 Datasheet

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FDMA7672

Manufacturer Part Number
FDMA7672
Description
This device has been designed to provide maximum efficiency and thermal performance for synchronous buck converters
Manufacturer
Fairchild Semiconductor
Datasheet

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©2012 Fairchild Semiconductor Corporation
FDMA7672 Rev.C4
FDMA7672
Single N-Channel PowerTrench
30 V, 9 A, 21 mΩ
Features
MOSFET Maximum Ratings
Thermal Characteristics
Package Marking and Ordering Information
V
V
I
P
T
R
R
R
D
J
DSS
GSS
D
θJC
θJA
θJA
Max r
Max r
Low Profile - 0.8 mm maximum - in the new package
MicroFET 2x2 mm
Free from halogenated compounds and antimony oxides
RoHS compliant
, T
Symbol
Device Marking
Drain
STG
DS(on)
DS(on)
Pin 1
672
= 21 mΩ at V
= 32 mΩ at V
MicroFET 2X2 (Bottom View)
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
Power Dissipation
Power Dissipation
Operating and Storage Junction Temperature Range
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
D
D
D
GS
GS
= 10 V, I
= 4.5 V, I
D
S
-Pulsed
FDMA7672
Device
G
D
D
= 9 A
= 7 A
T
A
Source
= 25 °C unless otherwise noted
Parameter
MicroFET 2x2
Package
®
T
T
T
A
A
A
MOSFET
= 25 °C
= 25 °C
= 25 °C
1
General Description
This device has been designed to provide maximum efficiency
and thermal performance for synchronous buck converters. The
low r
performance.
Application
G
D
D
DC – DC Buck Converters
DS(on)
1
2
3
Reel Size
and gate charge provide excellent switching
Bottom Drain Contact
7 ’’
(Note 1a)
(Note 1a)
(Note 1b)
(Note 1a)
(Note 1b)
Tape Width
12 mm
–55 to +150
Ratings
±20
145
6
2.4
0.9
6.9
5
4
30
24
52
9
D
D
S
January 2012
www.fairchildsemi.com
3000 units
Quantity
Units
°C/W
°C
W
V
V
A

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FDMA7672 Summary of contents

Page 1

... Thermal Resistance, Junction to Ambient θJA Package Marking and Ordering Information Device Marking Device 672 FDMA7672 ©2012 Fairchild Semiconductor Corporation FDMA7672 Rev.C4 ® MOSFET General Description = 9 A This device has been designed to provide maximum efficiency D and thermal performance for synchronous buck converters. The ...

Page 2

... Reverse Recovery Charge rr NOTES determined with the device mounted θJA the user's board design. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. ©2012 Fairchild Semiconductor Corporation FDMA7672 Rev. °C unless otherwise noted J Test Conditions = 250 μ 250 μ ...

Page 3

... DUTY CYCLE = 0.5% MAX 125 1.0 1.5 2.0 2.5 3 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics ©2012 Fairchild Semiconductor Corporation FDMA7672 Rev. 25°C unless otherwise noted J 4.5 4 3.5 3.0 2.5 2 μ s 1.0 0.5 1.5 2 100 125 150 ...

Page 4

... DRAIN to SOURCE VOLTAGE (V) DS Figure 9. Forward Bias Safe Operating Area 2 DUTY CYCLE-DESCENDING ORDER 0.5 0.2 0.1 0.05 0.1 0.02 0.01 0.01 0.001 - ©2012 Fairchild Semiconductor Corporation FDMA7672 Rev. 25°C unless otherwise noted J 1000 100 = 1000 100 0 100 ...

Page 5

... PLANE PIN #1 IDENT 0.33 0.20 0.65 A. DOES NOT FULLY CONFORM TO JEDEC REGISTRATION MO-229 DATED AUG/2003 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994 D. DRAWING FILENAME: MKT-MLP06Lrev2. ©2012 Fairchild Semiconductor Corporation FDMA7672 Rev.C4 2.000 2.000 0. RECOMMENDED LAND PATTERN OPT 1 (0.20) C (0.30) 1.000 0.800 ...

Page 6

... Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2012 Fairchild Semiconductor Corporation FDMA7672 Rev.C4 ® PowerTrench PowerXS™ SM Programmable Active Droop™ ® QFET QS™ Quiet Series™ RapidConfigure™ ™ ...

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