BTS 50060-1TEA Infineon Technologies, BTS 50060-1TEA Datasheet - Page 10

• Manufacturer Part Number: BTS 50060-1TEA
• Manufacturer: Infineon Technologies

Specifications of BTS 50060-1TEA

• Packages: PG-TO252-5
• Channels: 1.0
• Ron @ Tj = 25°c: 6.0 mOhm
• Recommended Operating Voltage Min.: 4.7 V
• Recommended Operating Voltage Max.: 28.0 V
• Il(sc): 60.0 A

4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
Table 4
Parameter
Thermal Resistance -
Junction to Case
Thermal Resistance -
Junction to Ambient - 2s2p
1) Not subject to production test, specified by design.
2) Specified
Figure 6
Jedec JESD51-2,-5,-7 at natural convection on FR4 1s and 2s2p board. The product (chip + package) was
simulated on a 76.4 × 114.3 × 1.5 mm board with 2 inner copper layers (2× 70µm Cu, 2× 35µm Cu). Where
applicable, a thermal via array under the exposed pad contacted the first inner copper layer. The PCB layer
structure is shown in
Datasheet
High current PROFET
Figure 6
(Chip+Package) was simulated on a 76.2
Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
to www.jedec.org.
and
R
Thermal Resistance
Thermal Resistance
Typical transient thermal impedance
Z
thJA
Figure 7
th(JA)
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
= f(t
Figure
TM
are showing the typical thermal impedance of BTS50060-1TEA mounted according to
P
) for different cooling areas
W
8. The PCB layout is shown in
Symbol
R
R
thJC
thJA_2s2p
1)
1)
×
114.3
Min.
–
–
×
1.5 mm board with 2 inner copper layers (2
Typ.
1
22
Values
10
Figure 7
Figure
Max.
1.1
–
9.
Typical transient thermal impedance
Z
duty cycles D = t / t
th(JA)
Unit
K/W
K/W
= f(t
General Product Characteristics
Note /
Test Condition
–
2)
P
) for PWM operation with
W
×
period
Rev. 1.2, 2011-09-01
BTS50060-1TEA
70 mm Cu, 2
on a 2s2p PCB
Number
P_4.27
P_4.29
×
35 mm