BSP300 Infineon Technologies, BSP300 Datasheet - Page 2

• Manufacturer Part Number: BSP300
• Manufacturer: Infineon Technologies

Specifications of BSP300

• Package: SOT-223
• Vds (max): 800.0 V
• Rds (on) (max) (@10v): 20,000.0 mOhm
• Rds (on) (max) (@4.5v): -
• Rds (on) (max) (@2.5v): -

1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm
Electrical Characteristics, at T
Rev 2.1
Maximum Ratings
Parameter
Chip or operating temperature
Storage temperature
Thermal resistance, chip to ambient air
Thermal resistance, junction-soldering point
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Parameter
Static Characteristics
Drain- source breakdown voltage
V
Gate threshold voltage
V
Zero gate voltage drain current
V
V
Gate-source leakage current
V
Drain-Source on-state resistance
V
GS
GS =
DS
DS
GS
GS
= 800 V, V
= 800 V, V
= 0 V, I
= 20 V, V
= 10 V, I
V
DS,
I
D
D
= 1 mA
D
= 0.25 mA, T
DS
GS
GS
= 0.19 A
= 0 V
= 0 V, T
= 0 V, T
j
j
j
= 25 °C
= 125 °C
= 25 °C
j
= 25°C, unless otherwise specified
1)
1)
2
copper area for drain connection
Page 2
Symbol
V
V
I
I
R
DSS
GSS
(BR)DSS
GS(th)
DS(on)
Symbol
T
T
R
R
j
stg
thJA
thJS
min.
-
-
-
-
800
2
Values
typ.
-
3
0.1
10
10
15
-55 ... + 150
-55 ... + 150
55 / 150 / 56
Values
≤
≤
E
70
14
max.
-
4
1
100
100
20
BSP300
2008-03-26
Unit
°C
K/W
Unit
V
µA
nA
Ω