BSD235C Infineon Technologies, BSD235C Datasheet
BSD235C
Specifications of BSD235C
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BSD235C Summary of contents
Page 1
... =-0. =0. =25 Ω =25 ° tot stg JESD22-A114-HBM T solder page 1 page 1 BSD235C =±4.5 V 1200 350 mΩ =±2.5 V 2100 600 -0.53 0.95 A PG-SOT-363 Lead Free Lead Free Packing Packing Yes Yes ...
Page 2
... DS(on)max =-0. |>2 DS(on)max N =0. page 2 page 2 Values min. typ. max 250 - - - -1.2 -0.9 -0.6 0.7 0.95 1 -100 = 100 = ±100 - 1221 2100 - 415 600 - 745 1200 - 266 350 , - 0 BSD235C Unit K/W V µA nA mΩ S 2012-02-16 2012-02-16 ...
Page 3
... =0. =- =-0. -4 plateau = =0. 4 plateau page 3 page 3 BSD235C Values Unit min. typ. max 4.5 ...
Page 4
... S,pulse =-0. =25 ° =0. =25 ° =± /dt =100 A/µ page 4 page 4 BSD235C Values Unit min. typ. max -0. 0.9 1 0.97 - 2012-02-16 2012-02-16 ...
Page 5
... Rev.2.3 Rev.2.3 2 Power dissipation (N) =f tot A 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0 120 120 160 160 4 Drain current (N) =f parameter: V ≥4 0.8 0.6 0.4 0.2 0 120 160 0 page 5 page 5 BSD235C 120 120 160 160 T T [°C] [° 120 160 T [°C] A 2012-02-16 2012-02-16 ...
Page 6
... µs 10 µs 100 µs 100 µ [V] [ 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p BSD235C 1 µs 1 µ 2012-02-16 2012-02-16 ...
Page 7
... GS 4 3 2.5 V 2.5 V 2 1 [V] [ =25 ° BSD235C 3.3 V 3 2012-02-16 2012-02-16 ...
Page 8
... DS(on)max j 150 °C 150 °C 25 °C 25 ° [V] [ =0. =4 98% typ - 100 T [°C] j BSD235C 3 3 140 180 2012-02-16 2012-02-16 ...
Page 9
... Avalanche characteristics (N) =f parameter ° page 9 page °C 25 °C 150 °C 150 °C 0 0.4 0.4 0.8 0.8 1.2 1 [V] [ =25 Ω GS j(start) 25 °C 100 °C 125 ° [µs] AV BSD235C 0.5 A 0.5 A 1.6 1 2012-02-16 2012-02-16 ...
Page 10
... Coss [V] page 10 page =1.6 µ 98% 98% typ typ 2% 2% -20 - 100 100 T T [°C] [° MHz [V] DS BSD235C 140 140 180 180 Ciss Coss Crss 20 2012-02-16 2012-02-16 ...
Page 11
... Drain-source breakdown voltage (N) =f(T V BR(DSS 100 140 180 -60 page 11 page =0.95 A pulsed gate 0.1 0.1 0.2 0.2 0.3 0.3 0.4 0 [nC] [nC] gate gate ); I =250 µ - 100 T [°C] j BSD235C 0.5 0.5 0.6 0.6 140 2012-02-16 2012-02-16 ...
Page 12
... Package Outline: Footprint: Reflow soldering: Dimensions in mm Rev.2.3 SOT-363 Packing: page 12 BSD235C 2012-02-16 ...
Page 13
... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev.2.3 Rev.2.3 page 13 page 13 BSD235C 2012-02-16 2012-02-16 ...