SIGC16T120CL Infineon Technologies, SIGC16T120CL Datasheet
SIGC16T120CL
Specifications of SIGC16T120CL
Related parts for SIGC16T120CL
SIGC16T120CL Summary of contents
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... I Die Size 4. suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC16T120CL G Package Ordering Code Q67041-A4703- sawn on foil A003 4. 16.16 / 10.4 1.88 x 2.18 0.71x1.08 180 ...
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... Symbol Conditions =600V =10A SIGC16T120CL Value 1200 -55 ... +150 Value min. typ. max. =500µA 1200 C =8A 1.8 2.2 2 4.5 5.5 6 =0V 1.1 GE ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7131-P, Edition 2, 03.09.2003 SIGC16T120CL ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7131-P, Edition 2, 03.09.2003 SIGC16T120CL ...