SIGC42T120CL Infineon Technologies, SIGC42T120CL Datasheet

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SIGC42T120CL

Manufacturer Part Number
SIGC42T120CL
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of SIGC42T120CL

Technology
Low Loss IGBT 2
Vds (max)
1,200.0 V
Ic (max)
25.0 A
Vce(sat) (max)
2.6 V
Vge(th) (min)
4.5 V
IGBT Chip in NPT-technology
FEATURES:
Chip Type
MECHANICAL PARAMETER:
Raster size
Emitter pad size
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
Edited by INFINEON Technologies AI PS DD HV3, L 7151-P, Edition 2, 03.09.2003
SIGC42T120CL
SIGC42T120CL
1200V NPT technology 180µm chip
low turn-off losses
short tail current
positive temperature coefficient
easy paralleling
V
1200V
1200V
CE
I
Cn
25A
25A
Die Size
6.59 x 6.49 mm
6.59 x 6.49 mm
This chip is used for:
Applications:
power module
BSM25GD120DLC E3224
drives
suitable for epoxy and soft solder die bonding
< 6 month at an ambient temperature of 23°C
store in original container, in dry nitrogen,
electrically conductive glue or solder
2 x ( 2.18 x 1.58 )
2
2
1400 nm Ni Ag –system
6.59 x 6.49
1.06 x 0.65
42.8 / 33.5
0.65mm ; max 1.2mm
SIGC42T120CL
3200 nm Al Si 1%
Package
180
150
sawn on foil
90
Al, <500µm
Photoimide
unsawn
334 pcs
Ordering Code
C67078-A4675-
C67078-A4675-
G
A001
A002
mm
mm
µm
grd
C
E
2

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SIGC42T120CL Summary of contents

Page 1

... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC42T120CL Package Ordering Code C67078-A4675- sawn on foil A001 C67078-A4675- unsawn ...

Page 2

... Symbol Conditions =600V SIGC42T120CL Value 1200 -55 ... +150 Value min. typ. max. = 1.5mA 1200 C =25A 1.8 2.2 2 4.5 5.5 6 =0V 3.2 GE ...

Page 3

... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7151-P, Edition 2, 03.09.2003 SIGC42T120CL ...

Page 4

... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7151-P, Edition 2, 03.09.2003 SIGC42T120CL Package Econo 2 short BSM25GD120DLC E3224 pin ...

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