SIGC12T120L Infineon Technologies, SIGC12T120L Datasheet
SIGC12T120L
Specifications of SIGC12T120L
Related parts for SIGC12T120L
SIGC12T120L Summary of contents
Page 1
... Die Size 3.54 x 3.5 mm 2.03 x 2.03 1400 –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC12T120L G Package Ordering Code Q67050- sawn on foil A4269-A101 mm 3.54 x 3.5 1.1 x 0.7 12.4 / 6.9 ...
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... Symbol Conditions =600V =8A SIGC12T120L Value 1200 -55 ... +150 Value min. typ. max. = 0.5mA 1200 C =8A 1.35 1.65 2. 5.0 5.8 6 =0V 1.07 GE ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L7621B, Edition 2, 04.09.03 SIGC12T120L ...
Page 4
... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L7621B, Edition 2, 04.09.03 SIGC12T120L tbd ...