... Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment Edited by INFINEON Technologies HV3, L7651B, Edition 2, 04.09.03 SIGC41T120R3L This chip is used for: power module Applications: drives I Die Size Cn 2 35A 6 ...
... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L7651B, Edition 2, 04.09.03 SIGC41T120R3L tbd ...