SIGC104T170R2C Infineon Technologies, SIGC104T170R2C Datasheet
SIGC104T170R2C
Specifications of SIGC104T170R2C
Related parts for SIGC104T170R2C
SIGC104T170R2C Summary of contents
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... Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment Edited by INFINEON Technologies HV3, L 7351M, Edition 2, 04.09.2003 SIGC104T170R2C This chip is used for: chip only Applications: drives I Die Size Cn 2 50A 10 ...
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... SWITCHING CHARACTERISTICS (tested at component), Inductive Load: Parameter Turn-on delay time Rise time Turn-off delay time Fall time 1) values also influenced by parasitic L- and C- in measurement and package. Edited by INFINEON Technologies HV3, L 7351M, Edition 2, 04.09.2003 SIGC104T170R2C Symbol jmax C I jmax ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7351M, Edition 2, 04.09.2003 SIGC104T170R2C ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7351M, Edition 2, 04.09.2003 SIGC104T170R2C chip only ...