SIGC121T120R2CL Infineon Technologies, SIGC121T120R2CL Datasheet

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SIGC121T120R2CL

Manufacturer Part Number
SIGC121T120R2CL
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of SIGC121T120R2CL

Technology
Low Loss IGBT 2
Vds (max)
1,200.0 V
Ic (max)
75.0 A
Vce(sat) (max)
2.6 V
Vge(th) (min)
4.5 V
IGBT Chip in NPT-technology
FEATURES:
Chip Type
MECHANICAL PARAMETER:
Raster size
Emitter pad size
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
Edited by INFINEON Technologies AI PS DD HV3, L 7171-P, Edition 2, 03.09.2003
SIGC121T120R2CL 1200V
1200V NPT technology
180µm chip
low turn-off losses
positive temperature coefficient
easy paralleling
integrated gate resistor
V
CE
I
Cn
75A
Die Size
11.08 X 11.08 mm
This chip is used for:
Applications:
power module
BSM75GD120DLC
drives
suitable for epoxy and soft solder die bonding
< 6 month at an ambient temperature of 23°C
store in original container, in dry nitrogen,
SIGC121T120R2CL
electrically conductive glue or solder
8 x ( 2.99 x 1.97 )
11.08 X 11.08
1400 nm Ni Ag –system
122.8 / 99.6
2
1.46 x 0.8
0.65mm ; max 1.2mm
3200 nm Al Si 1%
Package
180
150
sawn on foil
90
Al, <500µm
Photoimide
104 pcs
Ordering Code
A4686-A003
G
Q67041-
mm
mm
µm
grd
C
E
2

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SIGC121T120R2CL Summary of contents

Page 1

... NPT technology 180µm chip low turn-off losses positive temperature coefficient easy paralleling integrated gate resistor Chip Type V CE SIGC121T120R2CL 1200V MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer ...

Page 2

... SWITCHING CHARACTERISTICS (tested at component), Inductive Load Parameter Turn-on delay time Rise time Turn-off delay time Fall time 1) values also influenced by parasitic L- and C- in measurement and package. Edited by INFINEON Technologies HV3, L 7171-P, Edition 2, 03.09.2003 SIGC121T120R2CL Symbol jmax C I jmax ...

Page 3

... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 7171-P, Edition 2, 03.09.2003 SIGC121T120R2CL ...

Page 4

... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 7171-P, Edition 2, 03.09.2003 SIGC121T120R2CL BSM75GD120DLC Package Econopack 3 ...

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