XC3S502 Xilinx Corp., XC3S502 Datasheet - Page 185
![no-image](/images/no-image-200.jpg)
XC3S502
Manufacturer Part Number
XC3S502
Description
Spartan-3 Fpga Family Complete Data Sheet
Manufacturer
Xilinx Corp.
Datasheet
1.XC3S502.pdf
(208 pages)
- Current page: 185 of 208
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Table 106: FG900 Package Pinout (Continued)
Table 107: User I/Os Per Bank for XC3S2000 in FG900 Package
Table 108: User I/Os Per Bank for XC3S4000 and XC3S5000 in FG900 Package
DS099-4 (v2.2) May 25, 2007
Product Specification
VCCAUX PROG_B
VCCAUX TCK
VCCAUX TDI
VCCAUX TDO
VCCAUX TMS
Bank
Bottom
Bottom
Edge
Edge
Right
Right
Left
Left
Top
Top
R
XC3S2000
Pin Name
Bank
Bank
I/O
I/O
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
PROG_B
TCK
TDI
TDO
TMS
XC3S4000
XC3S5000
Pin Name
Maximum
Maximum
I/O
I/O
71
71
69
71
72
71
69
71
79
79
79
79
80
79
79
79
Number
FG900
C28
B28
A28
Pin
C3
B3
CONFIG
I/O
I/O
62
62
61
62
57
55
60
62
70
70
71
70
65
63
70
70
JTAG
JTAG
JTAG
JTAG
Type
www.xilinx.com
User I/Os by Bank
Table 107
tributed between the eight I/O banks for the XC3S2000 in
the FG900 package. Similarly,
available user-I/O pins are distributed between the eight I/O
banks for the XC3S4000 and XC3S5000 in the FG900
package.
DUAL
DUAL
0
0
0
0
6
6
0
0
0
0
0
0
6
6
0
0
All Possible I/O Pins by Type
All Possible I/O Pins by Type
indicates how the available user-I/O pins are dis-
Spartan-3 FPGA Family: Pinout Descriptions
DCI
DCI
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
VREF
VREF
Table 108
5
5
6
7
5
6
7
7
5
5
6
7
5
6
7
7
shows how the
GCLK
GCLK
2
2
0
0
2
2
0
0
2
2
0
0
2
2
0
0
185
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