RMPA1963 Fairchild Semiconductor, RMPA1963 Datasheet

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RMPA1963

Manufacturer Part Number
RMPA1963
Description
Us-pcs Cdma, Cdma2000-1x And Wcdma Power Amplifier Module
Manufacturer
Fairchild Semiconductor
Datasheet

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RMPA1963
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©2005 Fairchild Semiconductor Corporation
RMPA1963
RMPA1963
US-PCS CDMA, CDMA2000-1X and WCDMA
Power Amplifier Module
Features
Device
Functional Block Diagram
38% CDMA/WCDMA efficiency at +28 dBm Pout
14% CDMA/WCDMA efficiency (85 mA total current) at
+16 dBm Pout
Meets HSDPA performance requirements
Linear operation in low-power mode up to +19 dBm
Low quiescent current (Iccq): 25 mA in low-power mode
Single positive-supply operation with low power and shut-
down modes
• 3.4V typical Vcc operation
• Low Vref (2.85V) compatible with advanced handset
Compact Lead-free compliant LCC package –
(4.0 X 4.0 x 1.5 mm nominal)
Industry standard pinout
Internally matched to 50 Ohms and DC blocked RF
input/output
Meets IS-95/CDMA2000-1XRTT/WCDMA performance
requirements
chipsets
i - L o ™
Rev. H
Vmode
RF IN
i - L o ™
Vcc1
GND
Vref
1
2
3
4
5
MMIC
MATCH
INPUT
BIAS/MODE SWITCH
PRELIMINARY
(Top View)
1
11 (paddle ground on package bottom)
General Description
The RMPA1963 Power Amplifier Module (PAM) is Fairchild’s lat-
est innovation in 50 Ohm matched, surface mount modules tar-
geting US-PCS CDMA/WCDMA/HSDPA and Wireless Local
Loop (WLL) applications. Answering the call for ultra-low DC
power consumption and extended battery life in portable elec-
tronics, the RMPA1963 uses novel proprietary circuitry to dra-
matically reduce amplifier current at low to medium RF output
power levels (< +16 dBm), where the handset most often oper-
ates. A simple two-state Vmode control is all that is needed to
reduce operating current by more than 50% at 16 dBm output
power, and quiescent current (Iccq) by as much as 70% com-
pared to traditional power-saving methods. No additional cir-
cuitry, such as DC-to-DC converters, are required to achieve
this remarkable improvement in amplifier efficiency. Further, the
4x4x1.5 mm LCC package is pin-compatible and a drop-in
replacement for last generation 4x4 mm PAMs widely used
today, minimizing the design time to apply this performance-
enhancing technology. The multi-stage GaAs Microwave Mono-
lithic Integrated Circuit (MMIC) is manufactured using Fairchild
RF’s InGaP Heterojunction Bipolar Transistor (HBT) process.
OUTPUT
MATCH
10
9
8
7
6
GND
GND
RF OUT
GND
Vcc2
www.fairchildsemi.com
May 2005
i -
L
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RMPA1963 Summary of contents

Page 1

... Loop (WLL) applications. Answering the call for ultra-low DC power consumption and extended battery life in portable elec- tronics, the RMPA1963 uses novel proprietary circuitry to dra- matically reduce amplifier current at low to medium RF output power levels (< +16 dBm), where the handset most often oper- ates ...

Page 2

... Case Operating Temperature DC Characteristics Iccq Quiescent Current Iref Reference Current Icc(off) Shutdown Leakage Current Notes: 1. All parameters met +25°C, Vcc = +3.4V, Vref = 2.85V and load VSWR 2. All phase angles. 3. Guaranteed by design. RMPA1963 Rev ™ 1 Parameter 1 Min Typ Max 1850 1910 28 ...

Page 3

... Vmode Bias Control Voltage (Low-Power) (High-Power) Pout Linear Output Power (High-Power) (Low-Power) Tc Case Operating Temperature DC Turn-On Sequence 1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16dBm) Low-Power: Vmode = 2V (Pout < 16dBm) RMPA1963 Rev ™ Min Typ Max 1850 1910 3.0 3.4 4.2 2.7 2.85 3.1 0 ...

Page 4

... Vmode 1000 pF RMPA1963 Rev ™ Part Number Description PC Board SMA Connector Terminals Assembly, RMPA1963 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3µF Capacitor (1206) 0.1µF Capacitor (0603) 0.1µF Capacitor (0603) Solder Paste Solder Paste 1000 pF 1000 Ohm TRL 2 ...

Page 5

... GND 4 Vmode 5 Vref 6 GND 7 GND 8 RF Out 9 GND 10 Vcc2 11 GND RMPA1963 Rev ™ TOP VIEW FRONT VIEW 3.50mm TYP. See Detail A 3.65mm 11 .18mm BOTTOM VIEW Description Supply Voltage to Input Stage RF Input Signal Ground High Power/Low Power Mode Control ...

Page 6

... Recommended Solder Reflow Profile 260 217 200 150 100 50 25 RMPA1963 Rev ™ Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. Reflow Profile • Ramp-up: During this stage the solvents are evaporated from the solder paste ...

Page 7

... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete RMPA1963 Rev ™ POP™ IntelliMAX™ ISOPLANAR™ Power247™ LittleFET™ PowerEdge™ PowerSaver™ ...

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