RMPA1967 Fairchild Semiconductor, RMPA1967 Datasheet

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RMPA1967

Manufacturer Part Number
RMPA1967
Description
Us-pcs Cdma, Cdma2000-1x And Wdcma Power Edge Power Amplifier Module
Manufacturer
Fairchild Semiconductor
Datasheet
©2005 Fairchild Semiconductor Corporation
RMPA1967 Rev. F
RMPA1967
US-PCS CDMA, CDMA2000-1X and WDCMA
Power Edge™ Power Amplifier Module
Features
Device
Functional Block Diagram
Single positive-supply operation and low power and
shutdown modes
40% CDMA/WCDMA efficiency at +28 dBm average output
power
Compact lead-free compliant, LCC package-
(3.0 x 3.0 x 1.0 mm nominal)
Internally matched to 50 Ohms and DC blocked RF
input/output
Meets CDMA2000-1XRTT/WCDMA performance require-
ments
Meets HSDPA performance requirements
Alternative pin-out to Fairchild RMPA1965
Vmode
RF IN
Vcc1
Vref
1
2
3
4
Match
Input
DC Bias Control
MMIC
(Top View)
1
General Description
The RMPA1967 power amplifier module (PAM) is designed for
CDMA, CDMA2000-1X, WCDMA and HSDPA personal commu-
nications system (PCS) applications. The 2-stage PAM is inter-
nally matched to 50 Ohms to minimize the use of external
components and features a low-power mode to reduce standby
current and DC power consumption during peak phone usage.
High power-added efficiency and excellent linearity are
achieved using Fairchild RF’s InGaP Heterojunction Bipolar
Transistor (HBT) process.
(paddle ground on
package bottom)
Output
Match
8
7
6
5
GND
GND
RF OUT
Vcc2
www.fairchildsemi.com
May 2005

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RMPA1967 Summary of contents

Page 1

... Vcc1 ©2005 Fairchild Semiconductor Corporation RMPA1967 Rev. F General Description The RMPA1967 power amplifier module (PAM) is designed for CDMA, CDMA2000-1X, WCDMA and HSDPA personal commu- nications system (PCS) applications. The 2-stage PAM is inter- nally matched to 50 Ohms to minimize the use of external components and features a low-power mode to reduce standby current and DC power consumption during peak phone usage ...

Page 2

... Case Operating Temperature DC Characteristics Quiescent Current Reference Current Shutdown Leakage Current Notes: 1. All parameters met +25° C, Vcc = +3.4V, Vref = 2.85V 1880MHz and load VSWR otherwise noted. 2. All phase angles. 3. Guaranteed by design. RMPA1967 Rev. F Symbol Vcc1, Vcc2 Vref Vmode Pin Tstg 1 Symbol Min Typ ...

Page 3

... Vcc = 3.4V, Vref = 2.85V, Vmode = 0V, Freq = 1880MHz -50 -55 -60 -65 -70 -75 -80 -85 - RMPA1967 3x3 US-PCS PAM 1880 1910 Frequency (MHz) RMPA1967 3x3 US-PCS PAM 1880 1910 Frequency (MHz) RMPA1967 3x3 US-PCS PAM Pout (dBm) RMPA1967 3x3 US-PCS PAM ...

Page 4

... RMPA1967 3x3 US-PCS PAM Vcc = 1.4V, Vref = 2.85V, Vmode = 2V, Pout = 16dBm -50 -52 -54 -56 -58 -60 -62 -64 -66 -68 -70 1850 1880 Frequency (MHz) RMPA1967 Rev. F RMPA1967 3x3 US-PCS PAM Vcc = 3.4V, Vref = 2.85V, Vmode = 2V, Pout = 16dBm 1910 1850 Frequency (MHz) RMPA1967 3x3 US-PCS PAM Vcc = 3 ...

Page 5

... Bias Control Voltage (low-power) (high-power) Linear Output Power (high-power) (low-power) Case Operating Temperature DC Turn-On Sequence 1) Vcc1 = Vcc2 = 3.4V (typical) 2) Vref = 2.85V (typical) 3) High-Power: Vmode = 0V (Pout > 16 dBm) Low-Power: Vmode = 2V (Pout < 16 dBm) RMPA1967 Rev. F Symbol Min Typical f 1850 Vcc1, Vcc2 3.0 3.4 Vref 2.7 2.85 0 Vmode 1 ...

Page 6

... SN63 A/R 9 SN96 Evaluation Board Schematic Vref 1000 pF Vmode SMA1 Ohm TRL Vcc1 3.3 µ RMPA1967 Rev Part Number Description PC Board SMA Connector Terminals Assembly, RMPA1967 1000pF Capacitor (0603) 1000pF Capacitor (0603) 3.3µF Capacitor (1206) 0.1µF Capacitor (0603) 0.1µF Capacitor (0603) ...

Page 7

... SEE DETAIL A 0.80mm Signal Descriptions Pin # Signal Name 1 Vref 2 Vmode Vcc1 5 Vcc2 6 RF Out 7 GND 8 GND RMPA1967 Rev. F TOP VIEW 8 1967 7 XYTT FRONT VIEW 5 6 2.65mm 1.40mm 0.175mm BOTTOM VIEW Description Reference Voltage High-Power/Low-Power Mode Control RF Input Signal ...

Page 8

... RMPA1967 Rev. F Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT attachment. Hand soldering is not recommended. • Reflow Profile – Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent solvent out-gassing ...

Page 9

... PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete RMPA1967 Rev. F POP™ IntelliMAX™ ISOPLANAR™ Power247™ LittleFET™ PowerEdge™ PowerSaver™ MICROCOUPLER™ PowerTrench MicroFET™ ...

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