FAN3850T Fairchild Semiconductor, FAN3850T Datasheet

FAN3850T

Manufacturer Part Number

FAN3850T

Description

Microphone Pre-Amplifier

Manufacturer

Fairchild Semiconductor

Datasheet

1.FAN3850T.pdf (11 pages)

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FAN3850T • Rev. 3.0.0

FAN3850T

Microphone Pre-Amplifier with Temperature

Compensation and Digital Output

Features



Applications



Ordering Information

Note:

FAN3850TUC15X35

Optimized for Mobile Handset and Notebook PC

Microphone Applications

Accepts Input from Electret Condenser Microphones

Pulse Density Modulation (PDM) Output

Standard 5-Wire Digital Interface

Negative Temperature Coefficient to Compensate for

ECM Positive Temperature Coefficient

Low Input Capacitance, High PSR, 20kHz

Pre-Amplifier

Low-Power, 1.5µA Sleep Mode

Typical 420µA Supply Current

Signal to Noise Ratio of 62.4dB(A)

Total Harmonic Distortion: 0.01%

Input Clock Frequency Range of 1-4MHz

Integrated Low Drop-Out Regulator (LDO)

Small 1.26mm x 0.86mm 6-Ball WLCSP

Part Number

Amplifier Gain: 15.7dB

Electret Condenser Microphones with Digital Output

Mobile Handsets

Headset Accessories

Personal Computers (PC)

Alternate gain options and temperature coefficient slopes are possible. Please contact a Fairchild representative.

Option

15.7dB

Gain

Temperature Range

-30°C to +85°C

Operating

Description

The FAN3850T integrates a pre-amplifier, LDO, and

Analog-to-Digital Converter (ADC) to convert Electret

Condenser Microphone (ECM) outputs to digital Pulse

Density Modulation (PDM) data streams. The pre-

amplifier accepts analog signals from the ECM and drives

an over-sampled sigma delta ADC and outputs PDM

data. The PDM digital audio has the advantage of noise

rejection and interface-to-mobile handset processors.

The FAN3850T is powered from the system supply rails

up to 3.63V, with a low power consumption of only

0.85mW, and less than 20μW in Power-Down Mode.

The device compensates for the temperature variation

of the microphone element to achieve a flat sensitivity

response over-temperature.

INPUT

6-Ball, Wafer-Level Chip-Scale

Package (WLCSP)

Pre-Amp

Figure 1. Block Diagram

Package

LDO

GND



Mode Ctrl

ADC

Sleep

October 2011

Tape & Reel

www.fairchildsemi.com

Packing

3000 Unit

Method

CLOCK

DATA

SELECT

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