74ABT16652CMTDX Fairchild Semiconductor, 74ABT16652CMTDX Datasheet

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74ABT16652CMTDX

Manufacturer Part Number
74ABT16652CMTDX
Description
IC TRANSCVR TRI-ST 16BIT 56TSSOP
Manufacturer
Fairchild Semiconductor
Series
74ABTr
Datasheet

Specifications of 74ABT16652CMTDX

Logic Type
Transceiver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
8
Current - Output High, Low
32mA, 64mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
56-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
© 1999 Fairchild Semiconductor Corporation
74ABT16652CSSC
74ABT16652CMTD
74ABT16652
16-Bit Transceivers and Registers with 3-STATE Outputs
General Description
The ABT16652 consists of sixteen bus transceiver circuits
with D-type flip-flops, and control circuitry arranged for mul-
tiplexed transmission of data directly from the input bus or
from the internal registers. Each byte has separate control
inputs which can be shorted together for full 16-bit opera-
tion. Data on the A or B bus will be clocked into the regis-
ters as the appropriate clock pin goes to HIGH logic level.
Output Enable pins (OEAB, OEBA) are provided to control
the transceiver function.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pin Descriptions
Order Number
A
B
CPAB
SAB
OEAB
0
0
–A
–B
Pin Names
n
16
16
, SBA
n
n
, CPBA
, OEBA
n
n
n
Package Number
MS56A
MTD56
Data Register A Inputs/
3-STATE Outputs
Data Register B Inputs/
3-STATE Outputs
Clock Pulse Inputs
Select Inputs
Output Enable Inputs
Descriptions
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
DS011599.prf
Features
Connection Diagram
Independent registers for A and B buses
Multiplexed real-time and stored data
Separate control logic for each byte
A and B output sink capability of 64 mA, source
capability of 32 mA
Guaranteed output skew
High impedance glitch free bus loading during entire
power up and power down cycle
Nondestructive hot insertion capability
Package Description
April 1993
Revised January 1999
www.fairchildsemi.com

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74ABT16652CMTDX Summary of contents

Page 1

... Select Inputs n n OEAB , OEBA Output Enable Inputs n n © 1999 Fairchild Semiconductor Corporation Features Independent registers for A and B buses Multiplexed real-time and stored data Separate control logic for each byte A and B output sink capability of 64 mA, source capability Guaranteed output skew ...

Page 2

Functional Description In the transceiver mode, data present at the HIGH imped- ance port may be stored in either the register or both. The select (SAB , SBA ) controls can multiplex stored and n n real-time. ...

Page 3

Function Table Inputs OEAB OEBA CPAB CPBA ...

Page 4

Absolute Maximum Ratings Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias V Pin Potential to CC Ground Pin Input Voltage (Note 3) Input Current (Note 3) Voltage Applied to Any Output in the Disable or Power-Off State in ...

Page 5

DC Electrical Characteristics (SSOP Package) Symbol Parameter V Quiet Output Maximum Dynamic V OLP OL V Quiet Output Minimum Dynamic V OLV OL V Minimum HIGH Level Dynamic Output Voltage OHV V Minimum HIGH Level Dynamic Input Voltage IHD V ...

Page 6

Extended AC Electrical Characteristics (SSOP Package) Symbol Parameter t Progagation Delay PLH t Clock to Bus PHL t Progagation Delay PLH t Bus to Bus PHL t Progagation Delay PLH t SBA or SAB to PHL ...

Page 7

Capacitance Symbol Parameter C Input Capacitance IN C (Note 17) I/O Capacitance I/O Note 17 measured at frequency MHz, per MIL-STD-883, Method 3012. I/O AC Loading *Includes jig and probe capacitance FIGURE 2. Standard AC Test ...

Page 8

Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide www.fairchildsemi.com Package Number MS56A 8 ...

Page 9

Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE ...

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