MT58V512V36D Micron Technology, MT58V512V36D Datasheet - Page 22
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MT58V512V36D
Manufacturer Part Number
MT58V512V36D
Description
(MT58xxxx) 16Mb SYNCBURST SRAM
Manufacturer
Micron Technology
Datasheet
1.MT58V512V36D.pdf
(34 pages)
READ/WRITE TIMING PARAMETERS
NOTE: 1. Q(A4) refers to output from address A4. Q(A4 + 1) refers to output from the next internal burst address following A4.
16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L1MY18D_2.p65 – Rev 7/00
BWa#-BWd#
SYM
t
f
t
t
t
t
t
t
t
KC
KF
KH
KL
KQ
KQLZ
OELZ
OEHZ
AS
ADDRESS
(NOTE 4)
(NOTE 2)
ADSC#
ADSP#
BWE#,
ADV#
OE#
CLK
CE#
D
Q
2. CE2# and CE2 have timing identical to CE#. On this diagram, when CE# is LOW, CE2# is LOW and CE2 is HIGH. When
3. The data bus (Q) remains in High-Z following a WRITE cycle unless an ADSP#, ADSC# or ADV# cycle is performed.
4. GW# is HIGH.
5. Back-to-back READs may be controlled by either ADSP# or ADSC#.
MIN
6.0
2.3
2.3
1.5
CE# is HIGH, CE2# is HIGH and CE2 is LOW.
0
0
A1
-6
High-Z
High-Z
MAX
166
3.5
3.5
t ADSS
t CES
t AS
A2
Back-to-Back READs
t ADSH
t CEH
t KH
t AH
MIN
7.5
2.5
2.5
1.5
0
0
t KC
t KQLZ
(NOTE 5)
Q(A1)
-7.5
t KL
MAX
t KQ
133
4.0
4.2
Q(A2)
MIN
t OEHZ
3.0
3.0
1.0
2.0
10
0
-10
MAX
t WS
Single WRITE
t DS
READ/WRITE TIMING
D(A3)
100
5.0
4.5
A3
t DH
t WH
UNITS
MHz
ns
ns
ns
ns
ns
ns
ns
ns
A4
22
t OELZ
PIPELINED, DCD SYNCBURST SRAM
16Mb: 1 MEG x 18, 512K x 32/36
SYM
t
t
t
t
t
t
t
t
t
ADSS
WS
DS
CES
AH
ADSH
WH
DH
CEH
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q(A4)
MIN
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
0.5
3
BURST READ
-6
Q(A4+1)
MAX
Q(A4+2)
MIN
1.5
1.5
1.5
1.5
0.5
0.5
0.5
0.5
0.5
-7.5
MAX
Q(A4+3)
DON’T CARE
MIN
2.0
2.0
2.0
2.0
0.5
0.5
0.5
0.5
0.5
©2000, Micron Technology, Inc.
D(A5)
-10
A5
ADVANCE
Back-to-Back
MAX
WRITEs
UNDEFINED
D(A6)
A6
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns