MT58V512V36D Micron Technology, MT58V512V36D Datasheet - Page 8
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MT58V512V36D
Manufacturer Part Number
MT58V512V36D
Description
(MT58xxxx) 16Mb SYNCBURST SRAM
Manufacturer
Micron Technology
Datasheet
1.MT58V512V36D.pdf
(34 pages)
FBGA PIN DESCRIPTIONS
16Mb: 1 Meg x 18, 512K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L1MY18D_2.p65 – Rev 7/00
3R, 4P, 4R, 6N, 3R, 4P, 4R, 6N,
10R, 11A, 11P, 10P, 10R, 11P,
8P, 8R, 9P, 9R,
10A, 10B, 10P, 9R, 10A, 10B,
2A, 2B, 3P,
x18
11H
11R
4A
7A
3A
6A
6R
6P
5B
7B
6B
3B
8B
–
–
2A, 2B, 3P,
8P, 8R, 9P,
x32/x36
11H
11R
6R
5B
5A
4A
4B
7A
7B
6B
3A
6A
3B
8B
6P
SYMBOL
OE#(G#)
BWa#
BWb#
BWd#
BWE#
BWc#
GW#
CE2#
SA0
SA1
CLK
CE#
CE2
SA
ZZ
Input Synchronous Address Inputs: These inputs are registered and must
Input Synchronous Byte Write Enables: These active LOW inputs allow
Input Byte Write Enable: This active LOW input permits BYTE WRITE
Input Synchronous Chip Enable: This active LOW input is used to enable
Input Synchronous Chip Enable: This active LOW input is used to enable
Input Snooze Enable: This active HIGH, asynchronous input causes the
Input Synchronous Chip Enable: This active HIGH input is used to enable
TYPE
Input Global Write: This active LOW input allows a full 18-, 32- or 36-bit
Input Clock: This signal registers the address, data, chip enable, byte write
Input Output Enable: This active LOW, asynchronous input enables the
(continued on next page)
meet the setup and hold times around the rising edge of CLK.
individual bytes to be written and must meet the setup and hold
times around the rising edge of CLK. A byte write enable is LOW
for a WRITE cycle and HIGH for a READ cycle. For the x18 version,
BWa# controls DQa’s and DQPa; BWb# controls DQb’s and DQPb.
For the x32 and x36 versions, BWa# controls DQa’s and DQPa; BWb#
controls DQb’s and DQPb; BWc# controls DQc’s and DQPc; BWd#
controls DQd’s and DQPd. Parity is only available on the x18 and
x36 versions.
operations and must meet the setup and hold times around the
rising edge of CLK.
WRITE to occur independent of the BWE# and BWx# lines and must
meet the setup and hold times around the rising edge of CLK.
enables, and burst control inputs on its rising edge. All synchronous
inputs must meet setup and hold times around the clock’s rising
edge.
the device and conditions the internal use of ADSP#. CE# is sampled
only when a new external address is loaded.
the device and is sampled only when a new external address is
loaded.
device to enter a low-power standby mode in which all data in the
memory array is retained. When ZZ is active, all other inputs are
ignored.
the device and is sampled only when a new external address is
loaded.
data I/O output drivers.
PIPELINED, DCD SYNCBURST SRAM
8
16Mb: 1 MEG x 18, 512K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DESCRIPTION
©2000, Micron Technology, Inc.
ADVANCE