IDT88P8344 Integrated Device Technology, IDT88P8344 Datasheet - Page 94
IDT88P8344
Manufacturer Part Number
IDT88P8344
Description
Spi Exchange 4 X Spi-3 To Spi-4 Issue 1.0
Manufacturer
Integrated Device Technology
Datasheet
1.IDT88P8344.pdf
(98 pages)
Available stocks
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IDT88P8344 SPI EXCHANGE 4 x SPI-3 TO SPI-4
INDUSTRIAL TEMPERATURE RANGE
12.3 Device package
The SPI Exchange IDT88P8344 device is packaged in a 35 mm by 35 mm
820-ball one millimeter ball pitch thermally-enhanced plastic ball grid array. All
balls, whether used or unused, must be soldered to pads.
Figure 42. IDT88P8344 820PBGA package, bottom view
APRIL 10, 2006
94
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