RM5261-200-QI PMC-Sierra Inc, RM5261-200-QI Datasheet - Page 37

• Manufacturer Part Number: RM5261-200-QI
• Description: RM5261 Microprocessor with 64-Bit System Bus Data Sheet Released
• Manufacturer: PMC-Sierra Inc

Proprietary and Confidential to PMC-Sierra, Inc and for its Customer’s Internal Use
Document ID: PMC-2002241, Issue 1
Symbol
aaa
ThetaJa
ThetaJc
Notes
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. The optional exposed heat shrink is coincident with the top or bottom side of the package and not allowed
11. These dimensions apply to the flat section of the lead between 0.10 MM and 0.25 MM from the lead tip.
12. This drawing conforms to JEDEC registered outline MS-029. But the heat slug dimension was not
13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
All dimensioning and tolerances confirm to ASME Y14.5–1994.
Datum Plane H located at the bottom of the mold parting line and coincident with where lead exits plastic
body.
Datums A–B and D to be determined where center line between leads exits plastic body at Datum Plane
H.
To be determined at seating Plane C.
Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 MM per side.
Dimension D1 and E1 do include mold mismatch and are determined at Datum Plane H.
“N” is number of terminals.
Package top dimensions are smaller than bottom dimensions by 0.20 millimeters and top of package will
not overhang bottom of package.
Dimensions b does not include Damabr protrusion. Allowable Damabr protrusion shall be 0.08 MM. Total
in excess of b dimension at maximum material condition. Damabr can not be located on the lower radius
or the foot. The dimension space between protrusion and an adjacent lead shall not be less than 0.07 MM
for 0.4 MM and 0.50 MM pitch package.
All dimensions are in millimeters.
to protrude beyond that surface.
specified on JEDEC.
208PQ4
Min Nominal
0.08
13.7 C/W
1.5 C/W
Max
Note
RM5261™ Microprocessor with 64-Bit System Bus Data Sheet
Released
37