W83877 Winbond Electronics Corp America, W83877 Datasheet - Page 125

• Manufacturer Part Number: W83877
• Description: Winbond I/O
• Manufacturer: Winbond Electronics Corp America

12.0 PACKAGE DIMENSIONS
(100-pin QFP)
30
1
Seating Plane
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change without notice.
100
31
See Detail F
e
H
D
D
b
81
50
y
A
A
80
51
2
1
E H
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
A
E
- 125 -
c
L
L
1
Detail F
Publication Release Date: January 1996
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Notes:
Symbol
1. Dimension D & E do not include interlead
2. Dimension b does not include dambar
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
A
A
A
b
c
D
H
H
L
L
y
E
e
flash.
protrusion/intrusion.
on final visual inspection spec.
1
D
E
1
2
Dimension in inches
0.728
0.964
0.039
0.004
0.107
0.010
0.004
0.546
0.782
0.020
0.087
Min. Nom. Max.
0
0.026
0.112
0.012
0.006
0.551
0.787
0.740
0.976
0.047
0.094
0.016
0.130
0.117
0.010
0.556
0.792
0.032
0.752
0.988
0.055
0.103
0.004
12
W83877F
Dimension in mm
13.87
19.87
18.49
24.49
0.10
2.73
0.25
0.10
0.50
2.21
Min.
1.00
0
Nom.
14.00
20.00
0.65
18.80
24.80
2.85
0.30
0.15
1.20
2.40
Revision A2
14.13
20.13
19.10
25.10
Max.
1.40
3.30
2.97
0.40
0.25
0.80
2.62
0.10
12