tea5766uk NXP Semiconductors, tea5766uk Datasheet - Page 54

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tea5766uk

Manufacturer Part Number
tea5766uk
Description
Tea5766uk Stereo Fm Radio + Rds
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
16. Soldering
TEA5766UK_1
Product data sheet
16.1 Introduction to soldering WLCSP packages
16.2 Board mounting
16.3 Reflow soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in Application Note
AN10439 “Wafer Level Chip Scale Package” and in Application Note AN10365 “Surface
mount reflow soldering description” .
Wave soldering is not suitable for this package.
Board mounting of a WLCSP requires several steps:
Key characteristics in reflow soldering are:
Table 35.
Table 36.
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
Rev. 01 — 22 March 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
Table 35
23) than a PbSn process, thus
and
220
220
350
36
TEA5766UK
Stereo FM radio + RDS
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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