tea5766uk NXP Semiconductors, tea5766uk Datasheet - Page 55

• Manufacturer Part Number: tea5766uk
• Description: Tea5766uk Stereo Fm Radio + Rds
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TEA5766UK_1
Product data sheet
16.3.1 Stand off
16.3.2 Quality of solder joint
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
The stand off between the substrate and the chip is determined by:
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
Fig 23. Temperature profiles for large and small components
•
•
•
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
MSL: Moisture Sensitivity Level
temperature
Figure
23.
Rev. 01 — 22 March 2007
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
temperature
TEA5766UK
Stereo FM radio + RDS
peak
© NXP B.V. 2007. All rights reserved.
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