kfm2g16q2a-deb8 Samsung Semiconductor, Inc., kfm2g16q2a-deb8 Datasheet - Page 14

• Manufacturer Part Number: kfm2g16q2a-deb8
• Description: 2gb Muxonenand A-die
• Manufacturer: Samsung Semiconductor, Inc.

2.6.2 External (BufferRAM) Memory Organization
The on-chip external memory is comprised of 3 buffers used for Boot Code storage and data buffering.
The BootRAM is a 1KB buffer that receives Boot Code from the internal memory and makes it available to the host at start up.
There are two independent 2KB bi-directional data buffers, DataRAM0 and DataRAM1. These dual buffers enable the host to execute simul-
taneous Read-While load, and Write-While-program operations after Boot Up. During Boot Up, the BootRam is used by the host to initialize
the main memory, and deliver boot code from NAND Flash core to host.
The external memory is divided into a main area and a spare area. Each buffer is the equivalent size of a Sector.
The main area data is 512B. The spare area data is 16B.
External Memory Array Information
MuxOneNAND2G(KFM2G16Q2A-DEBx)
MuxOneNAND4G(KFN4G16Q2A-DEBx)
Sector
Number of Sectors
Host
Total Size
Area
Spare
Main
External (BufferRAM)
DataRAM0 (2KB)
DataRAM1 (2KB)
BootRAM (1KB)
BootRAM
1KB+32B
512B
16B
Memory
2
- 14 -
DataRAM0
2KB+64B
512B
16B
4
Boot code (1KB)
Internal (Nand Array)
Nand Array
OTP Block
Memory
FLASH MEMORY
DataRAM1
2KB+64B
512B
16B
4