AMD-K6-2E/400AFR AMD [Advanced Micro Devices], AMD-K6-2E/400AFR Datasheet - Page 281

• Manufacturer Part Number: AMD-K6-2E/400AFR
• Manufacturer: AMD [Advanced Micro Devices]

22529B/0—January 2000
Decoupling
Recommendations
Chapter 14
Figure 88. Suggested Component Placement
In addition to the isolation region mentioned in “Power
Connections” on page 262, adequate decoupling capacitance is
required between the two system power planes and the ground
plane to minimize ringing and to provide a low-impedance path
for return currents. Suggested decoupling capacitor placement
is shown in Figure 88.
Surface mounted capacitors should be used as close as possible
to the processor to minimize resistance and inductance in the
lead lengths while maintaining minimal height.
For recommendations about the specific value, quantity, and
location of the capacitors illustrated in Figure 88, see the AMD-
K6® Processor Power Supply Design Application Note, order
#21103.
V
CC3
Electrical Data
(I/O) Plane
C13
C12
C11
C5
C6
C7
C1
C2
+
+
C26
C18
CC5
CC6
V
CC3
CC4
0.254mm (min.) for
isolation region
CC2
C19
C27
C28
C17
CC1
AMD-K6™-2E Processor Data Sheet
(Core) Plane
+
+
+
C24
C20
C21
C22
C23
C25
C29
C30
C31
CC2
263