DAC1208D650HN NXP [NXP Semiconductors], DAC1208D650HN Datasheet - Page 89
DAC1208D650HN
Manufacturer Part Number
DAC1208D650HN
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.DAC1208D650HN.pdf
(98 pages)
- Current page: 89 of 98
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NXP Semiconductors
11. Package outline
Fig 26. Package outline SOT804 (HVQFN64)
DAC1208D650
Product data sheet
HVQFN64: plastic thermal enhanced very thin quad flat package; no leads;
64 terminals; body 9 x 9 x 0.85 mm
Dimensions
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
mm
SOT804-3
Unit
Outline
version
max
nom
min
terminal 1
index area
terminal 1
index area
1.00
0.85
0.80
L
A
E
0.05
0.02
0.00
h
A
16
1
1
17
0.30
0.21
0.18
64
b
IEC
- - -
0.2
c
D
e
9.1
9.0
8.9
(1)
D
e
D
7.25
7.10
6.95
1
h
D
JEDEC
h
All information provided in this document is subject to legal disclaimers.
- - -
1/2 e
E
9.1
9.0
8.9
(1)
References
Rev. 2 — 14 December 2010
7.25
7.10
6.95
b
E
h
0
49
32
0.5
e
33
48
JEITA
2×, 4× or 8× interpolating DAC with JESD204A interface
- - -
B
e
scale
7.5
e
w
2.5
v
1
1/2 e
A
E
C
C
7.5
e
2
A
e
2
B
0.5
0.4
0.3
5 mm
L
0.1
v
A
0.05
w
A
1
0.05
y
y
1
C
DAC1208D650
European
projection
0.1
y
detail X
1
C
X
y
© NXP B.V. 2010. All rights reserved.
Issue date
09-02-24
10-08-06
c
sot804-3_po
SOT804-3
89 of 98
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