A3P060-1VQ144T ACTEL [Actel Corporation], A3P060-1VQ144T Datasheet - Page 17

• Manufacturer Part Number: A3P060-1VQ144T
• Description: Automotive ProASIC3 Flash Family FPGAs
• Manufacturer: ACTEL [Actel Corporation]

Maximum Power Allowed
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
resistivity is θ
maximum junction temperature is 110°C.
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and
in still air.
Table 2-4 •
Temperature and Voltage Derating Factors
Table 2-5 •
Package Type
Very Thin Quad Flat Pack (VQFP)
Fine Pitch Ball Grid Array (FBGA)
*
Array Voltage V
1.425
1.5
1.575
This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package
thermal information will be available in future revisions of the datasheet.
ja
Package Thermal Resistivities
Temperature and Voltage Derating Factors for Timing Delays
(normalized to T
=
. The thermal characteristics for θ
Max. junction temp. (°C) Max. ambient temp. (°C)
-------------------------------------------------------------------------------------------------------------------------------------- -
CC
(V)
–40°C
0.83
0.79
0.76
J
= 115°C, V
θ
ja
0.88
0.83
0.80
0°C
All devices
(°C/W)
See note*
See note*
See note*
A3P1000
A3P1000
A3P1000
–
Device
v1.0
CC
EQ 2-2
= 1.425 V)
25°C
0.90
0.85
0.82
Automotive ProASIC3 DC and Switching Characteristics
ja
are shown for two air flow rates. The absolute
Count
shows a sample calculation of the absolute
100
144
256
484
144
256
484
Pin
jc
and the junction-to-ambient air thermal
70°C
0.95
0.90
0.87
10.0 35.3
3.8
3.8
3.2
6.3
6.6
8.0
θ
jc
85°C
0.97
0.92
0.88
=
26.9
26.6
20.5
31.6
28.1
23.3
Still
Air
110°C 70°C
------------------------------------
20.5°C/W
ft./min.
115°C
1.00
0.95
0.91
29.4
22.9
22.8
17.0
26.2
24.4
19.0
–
200
θ
ja
=
125°C
ft./min.
1.01
0.96
0.93
27.1
21.5
21.5
15.9
24.2
22.7
16.7
1.951 W
500
135°C
1.02
0.97
0.94
EQ 2-2
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
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